公开(公告)号：US09386697B2

公开(公告)日：2016-07-05

申请号：US14302946

申请日：2014-06-12

申请人： TDK Corporation

发明人： Hiroyuki Uematsu ,  Kenichi Kawabata

IPC分类号： H05K1/11 ,  H05K1/18 ,  H05K3/42 ,  H05K3/00

CPC分类号： H05K1/115 ,  H01L2224/04105 ,  H05K1/185 ,  H05K1/188 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/427 ,  H05K2201/0187 ,  H05K2201/09563 ,  H05K2203/095 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49147 ,  Y10T29/49165

摘要： A wiring board or an electronic component embedded substrate includes a substrate that includes a resin containing a plurality of fillers; and a via that is electrically connected to at least one interconnect provided to the substrate, wherein the via includes a mix area in which metal is provided between the fillers on an inner radial side with respect to the substrate. A method of manufacturing a wiring board or an electronic component embedded substrate includes preparing a substrate that includes a resin containing a plurality of fillers; forming a via formation hole in the substrate; performing an ashing process on at least an inner wall of the via formation hole; and performing electroless plating on the inner wall of the via formation hole.

摘要翻译： 布线基板或电子部件嵌入基板包括：基板，其具有含有多个填料的树脂; 以及通孔，其电连接到提供给基板的至少一个互连件，其中所述通孔包括混合区域，在所述混合区域中，在相对于所述基板的内径向侧的所述填料之间设置有金属。 制造布线板或电子部件嵌入式基板的方法包括制备包括含有多种填料的树脂的基板; 在所述基板中形成通孔形成孔; 在通孔形成孔的至少内壁上进行灰化处理; 并且在通孔形成孔的内壁上进行无电镀。