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公开(公告)号：US11557434B2
公开(公告)日：2023-01-17
申请号：US17116336
申请日：2020-12-09
申请人： TAIYO YUDEN CO., LTD
发明人： Satoshi Kobayashi , Takahisa Fukuda , Tomoaki Nakamura , Mikio Tahara , Naoki Saito , Kiyoshiro Yatagawa
摘要： A ceramic electronic component includes external electrodes having conductive resin layers thereinside on respective two ends opposed to each other in a rectangular parallelepiped ceramic component body. Each of the external electrodes includes an underlying metal layer, an intermediate metal layer, a conductive resin layer, an external metal layer. A tip angle α between an outer face of a tip portion of the wraparound portion of the underlying metal layer and a surface of the ceramic component body is 20° or smaller, and a tip angle β between an outer face of a tip portion of the wraparound portion of the intermediate metal layer and a surface of the ceramic component body is 20° or smaller.
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公开(公告)号：US11551868B2
公开(公告)日：2023-01-10
申请号：US17209025
申请日：2021-03-22
摘要： A ceramic electronic device includes: a ceramic main body of a parallelepiped shape having at least two edge faces facing each other, and having an internal electrode layer inside; and external electrodes formed on the two edge faces and having a structure in which a plated layer is formed on a ground layer having a metal, as a main component, and ceramic; the external electrodes have an extension region which extends to at least one of four side faces from the two edge faces, and a part of which corresponds to a corner portion of the ceramic main body and includes a portion with the ground layer and a first portion, without the ground layer, arranged at a position where one of the two end faces and one of the four side faces are connected; and the plated layer covers the ground layer and the first portion.
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公开(公告)号：US11107631B2
公开(公告)日：2021-08-31
申请号：US16138148
申请日：2018-09-21
摘要： A ceramic electronic device includes: a ceramic main body having at least two edge faces facing each other; and external electrodes formed on the two edge faces, wherein: the external electrodes have a structure in which a plated layer is formed on a ground layer having ceramic; a main component of the ground layer is a metal; the external electrodes have an extension region that extends to at least one of four side faces from the two edge faces of the ceramic main body; a part of the extension region corresponding to a corner portion of the ceramic main body has a first portion having a maximum spaced distance of 10 μm or less in a face direction of the ground layer; and the plated layer has an average thickness that is 30% or more with respect to the maximum spaced distance, and covers the first portion.
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公开(公告)号：US11705281B2
公开(公告)日：2023-07-18
申请号：US17359238
申请日：2021-06-25
发明人： Tomoaki Nakamura , Mikio Tahara , Masako Kanou , Fusao Sato
CPC分类号： H01G4/30 , H01G4/012 , H01G4/1227 , H01G4/228
摘要： A multilayer ceramic capacitor includes: a multilayer chip in which dielectric layers mainly composed of ceramic and internal electrode layers are alternately stacked so that the internal electrode layers are alternately exposed to two end faces of the multilayer chip having a substantially rectangular parallelepiped shape; and a pair of external electrodes formed from the two end faces to at least one side face of side faces, wherein each external electrode includes a metal layer formed from the end face to the at least one side face and mainly composed of copper, and an oxide layer covering at least a part of the metal layer, mainly composed of copper oxide, and having a maximum thickness of 0.5 μm or greater, wherein a first surface, which is in contact with the plated layer, of the oxide layer has Cu particles formed thereon.
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公开(公告)号：US11581140B2
公开(公告)日：2023-02-14
申请号：US17038805
申请日：2020-09-30
发明人： Tomoaki Nakamura , Mikio Tahara , Sadanori Shimoda
摘要： A ceramic electronic component includes a multilayer chip having a substantially rectangular parallelepiped shape and including dielectric layers and internal electrode layers that are alternately stacked, the internal electrode layers being alternately exposed to two edge faces of the multilayer chip facing each other, and a pair of external electrodes respectively formed on the two edge faces so as to be connected to the internal electrode layers exposed on the respective edge faces, each external electrode extending to at least one side face of the multilayer chip, wherein in the multilayer chip, oxides including Zn and Ni are present around the internal electrode layer in a vicinity of a connection part connecting the internal electrode layer to the external electrode.
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6.发明授权公开(公告)号：US11081282B2
公开(公告)日：2021-08-03
申请号：US16410914
申请日：2019-05-13
发明人： Tomoaki Nakamura , Mikio Tahara , Masako Kanou , Fusao Sato
摘要： A multilayer ceramic capacitor includes: a multilayer chip in which dielectric layers mainly composed of ceramic and internal electrode layers are alternately stacked so that the internal electrode layers are alternately exposed to two end faces, which face each other, of the multilayer chip, the multilayer chip having a substantially rectangular parallelepiped shape; and a pair of external electrodes formed from the two end faces of the multilayer chip to at least one side face of side faces of the multilayer chip, wherein each of the pair of external electrodes includes a metal layer and an oxide layer, the metal layer being formed from the end face to the at least one side face and being mainly composed of copper, the oxide layer covering at least a part of the metal layer, being mainly composed of copper oxide, and having a maximum thickness of 0.5 μm or greater.
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公开(公告)号：US09837213B2
公开(公告)日：2017-12-05
申请号：US14781017
申请日：2014-03-17
发明人： Koji Otsuka , Tomoaki Nakamura
摘要： In an embodiment of a ceramic electronic component, an external electrode 12 of a capacitor 10 has one first planar part SEa of roughly rectangular profile positioned on a surface that specifies the length dimension of the ceramic chip 11, as well as four second planar parts SEb of roughly rectangular profile positioned on both surfaces that specify the height dimension, and both surfaces that specify the width dimension, of the ceramic chip 11 and also continuing to the first planar part SEa. The second planar part SEb is constituted by a baked metal film 12a formed on the exterior surface of the ceramic chip 11 and a plated metal film 12b formed on the exterior surface of the baked metal film 12a via an adhesive force mitigation film 12c.
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公开(公告)号：US09349539B2
公开(公告)日：2016-05-24
申请号：US13949028
申请日：2013-07-23
CPC分类号： H01G4/30 , H01G4/12 , H01G4/2325
摘要： A ceramic electronic component includes external electrodes having a multi-layer structure including an intermediate conductive resin layer, wherein the intermediate conductive resin layer in the external electrode is made of epoxy resin containing conductive filler, and the intermediate conductive resin layer meets both the condition B/A≦0.47 and condition C/A≧0.39 (A, B and C represent the maximum spectral intensities obtained based on the relationship line of the wave number and spectral intensity of the intermediate conductive resin layer as obtained by the ATR method). The ceramic electronic component minimizes separation that could occur at the interface between such intermediate conductive resin layer and a metal layer.
摘要翻译： 陶瓷电子部件包括具有包括中间导电树脂层的多层结构的外部电极，其中外部电极中的中间导电树脂层由包含导电填料的环氧树脂制成，并且中间导电树脂层满足条件B （A，B，C表示通过ATR法获得的基于中间导电性树脂层的波数和光谱强度的关系线得到的最大光谱强度）。 陶瓷电子部件最小化在这种中间导电树脂层和金属层之间的界面处可能发生的分离。
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公开(公告)号：US11049660B2
公开(公告)日：2021-06-29
申请号：US16354811
申请日：2019-03-15
摘要： A multi-layer ceramic electronic component includes a ceramic body including: a multi-layer unit including a capacitance forming unit including ceramic layers laminated in a first direction and internal electrodes disposed therebetween, a side surface facing in a second direction orthogonal to the first direction, an end surface facing in a third direction orthogonal to the above directions, a drawn portion extending from the capacitance forming unit in the third direction, the internal electrodes being drawn to the end surface, and a cover that covers the capacitance forming unit and the drawn portion in the first direction; and a side margin that covers the side surface. The drawn portion includes a first region and a second region disposed between the cover and the first region, an end portion of each internal electrode in the second region being positioned inward in the second direction relative to that in the first region.
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公开(公告)号：US11842854B2
公开(公告)日：2023-12-12
申请号：US17563474
申请日：2021-12-28
CPC分类号： H01G4/232 , H01G4/12 , H01G4/30 , H01G13/006
摘要： A ceramic electronic device includes: a ceramic main body having a parallelepiped shape in which edges of first internal electrode layers are led out to a first edge face and edges of second internal electrode layer are led out to a second edge face facing the first edge face; and external electrodes respectively formed on the first edge face and the second edge face and extending to at least one side face of the ceramic main body, wherein a distance in a length direction between first conductive layers of the respective external electrodes on the at least one side face is shorter between locations corresponding to corner portions of the ceramic main body, respectively, than between center portions of the first conductive layers of the respective external electrodes in a width direction orthogonal to the length direction on the at least one side face.
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