公开(公告)号：US11924965B2

公开(公告)日：2024-03-05

申请号：US17728758

申请日：2022-04-25

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.

Inventor： Chun-Wei Chang ,  Jian-Hong Lin ,  Shu-Yuan Ku ,  Wei-Cheng Liu ,  Yinlung Lu ,  Jun He

IPC: H05K1/11 ,  H05K1/02 ,  H05K3/42

CPC classification number: H05K1/0242 ,  H05K1/0251 ,  H05K1/116 ,  H05K3/427 ,  H05K3/429 ,  H05K2201/0776

Abstract: A package component and forming method thereof are provided. The package component includes a substrate and a conductive layer. The substrate includes a first surface. The conductive layer is disposed over the first surface. The conductive layer includes a first conductive feature and a second conductive feature. The second conductive feature covers a portion of the first conductive feature. A resistance of the second conductive feature is lower than a resistance of the first conductive feature.