公开(公告)号：US12009260B2

公开(公告)日：2024-06-11

申请号：US17011801

申请日：2020-09-03

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.

Inventor： Ka Fai Chang ,  Fong-Yuan Chang ,  Chin-Chou Liu ,  Yi-Kan Cheng

IPC: H01L21/822 ,  G06F30/398 ,  G06F119/06 ,  H01L23/00 ,  H01L23/522 ,  H01L23/528

CPC classification number: H01L21/8221 ,  G06F30/398 ,  H01L23/5227 ,  H01L23/5286 ,  H01L24/42 ,  G06F2119/06

Abstract: A method for forming an integrated circuit (IC) is provided. The method includes the following operations. A circuit layout including a first load region and a second load region is received. A full power network of the circuit layout is obtained. The full power network is transformed into a first power network according to the first load region. A first power simulation is performed upon the first power network. The full power network is transformed into a second power network according to the second load region. A second power simulation is performed upon the second power network. The IC is fabricated according to the circuit layout.

公开(公告)号：US10811316B2

公开(公告)日：2020-10-20

申请号：US16102589

申请日：2018-08-13

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.

Inventor： Ka Fai Chang ,  Fong-Yuan Chang ,  Chin-Chou Liu ,  Yi-Kan Cheng

IPC: H01L21/822 ,  H01L23/522 ,  H01L23/528 ,  H01L23/00

Abstract: A method for forming an integrated circuit (IC) is provided. The method includes the following operations. A circuit layout including a first load region and a second load region is received. A full power network of the circuit layout is obtained. The full power network is transformed into a first power network according to the first load region. A first power simulation is performed upon the first power network. The full power network is transformed into a second power network according to the second load region. A second power simulation is performed upon the second power network. The IC is fabricated according to the circuit layout.