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公开(公告)号:US12068394B2
公开(公告)日:2024-08-20
申请号:US17306120
申请日:2021-05-03
发明人: Chia-Wei Chang , Chiung Wen Hsu , Yu-Ting Weng
IPC分类号: H01L29/78 , H01L21/3065 , H01L21/308 , H01L21/311 , H01L21/762 , H01L29/66
CPC分类号: H01L29/66795 , H01L21/3065 , H01L21/30655 , H01L21/3085 , H01L21/31116 , H01L21/76232 , H01L29/785 , H01L29/7851 , H01L29/7853
摘要: A semiconductor device includes a substrate, a fin structure protruding from the substrate, a gate insulating layer covering a channel region formed of the fin structure, a gate electrode layer covering the gate insulating layer, and isolation layers disposed on opposite sides of the fin structure. The fin structure includes a bottom portion, a neck portion, and a top portion sequentially disposed on the substrate. A width of the neck portion is less than a width of the bottom portion and a width of a portion of the top portion.
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公开(公告)号:US20240055526A1
公开(公告)日:2024-02-15
申请号:US17886433
申请日:2022-08-11
发明人: Yu-Chi LIN , Yu-Ting WENG , Chiung Wen Hsu , Chao-Cheng Chen
IPC分类号: H01L29/78 , H01L29/66 , H01L29/06 , H01L21/8234 , H01L21/311
CPC分类号: H01L29/7851 , H01L29/66795 , H01L29/0649 , H01L21/823431 , H01L21/31116
摘要: A semiconductor device and a method of fabricating a semiconductor device are provided herein. The semiconductor device includes a substrate; a fin structure arranged on the substrate and including a ridge portion and a bottom portion between the ridge portion and the substrate, wherein the ridge portion comprises a channel region and a fin region between the channel region and the bottom portion, a critical dimension of the bottom portion in a cross-fin direction is gradually increased toward the substrate to twice or more of a critical dimension of the channel region in the cross-fin direction; a metal gate structure disposed on the fin structure extending the cross-fin direction; and an epitaxy region disposed beside the metal gate structure in a lengthwise direction of the fin structure and connected to the fin structure.
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