公开(公告)号：US20230183855A1

公开(公告)日：2023-06-15

申请号：US18108866

申请日：2023-02-13

申请人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

发明人： PO-WEI WANG ,  Chao-Hsing LAI

IPC分类号： C23C14/35 ,  C23C14/00 ,  C23C14/34 ,  C23C14/50 ,  H01J37/32

CPC分类号： C23C14/35 ,  C23C14/0063 ,  C23C14/3407 ,  C23C14/50 ,  H01J37/32449 ,  H01J37/3244 ,  H01J37/3411

摘要： Embodiments of the present disclosure provide a substrate processing system. In one embodiment, the system includes a chamber, a target disposed within the chamber, a magnetron disposed proximate the target, a pedestal disposed within the chamber, and a first gas injector disposed at a sidewall of the chamber. The first gas injector includes a first gas channel extending through a body of the first gas injector, the first gas channel has a first gas outlet. The first gas injector also includes a second gas channel extending through the body of the first gas injector, wherein the second gas channel has a second gas outlet. The second gas channel includes a first portion, and a second portion branching off from an end of the first portion, wherein the second portion is disposed at an angle with respect to the first portion, and the first gas injector is operable to rotate about a longitudinal center axis of the body of the first gas injector.

公开(公告)号：US20230060764A1

公开(公告)日：2023-03-02

申请号：US17459672

申请日：2021-08-27

申请人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

发明人： Po-Wei WANG ,  Chao-Hsing LAI ,  Hsiao-Feng LU

IPC分类号： H01L21/02

摘要： A device for cleaning a wafer in a semiconductor manufacturing apparatus includes a showerhead and an adjustable distributor assembly. The showerhead is disposed over a wafer stage within a cleaning chamber and configured to eject cleaning material through the showerhead towards a cleaning surface of a wafer. The adjustable distributor assembly is disposed within the showerhead through which the cleaning material passes. The adjustable distributor assembly includes a base sheet and a plurality of control sheets. The base sheet includes base openings, and the plurality of control sheets include control openings and are configured to slidably mate with the base sheet to provide selectively adjustable openings.

公开(公告)号：US20240183025A1

公开(公告)日：2024-06-06

申请号：US18406062

申请日：2024-01-05

申请人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

发明人： Po-Wei WANG ,  Chao-Hsing LAI

IPC分类号： C23C14/35 ,  C23C14/00 ,  C23C14/34 ,  C23C14/50 ,  H01J37/32 ,  H01J37/34

CPC分类号： C23C14/35 ,  C23C14/0063 ,  C23C14/3407 ,  C23C14/50 ,  H01J37/3244 ,  H01J37/32449 ,  H01J37/3411

摘要： Embodiments of the present disclosure provide a substrate processing system. In one embodiment, the system includes a chamber, a target disposed within the chamber, a magnetron disposed proximate the target, a pedestal disposed within the chamber, and a first gas injector disposed at a sidewall of the chamber. The first gas injector includes a first gas channel extending through a body of the first gas injector, the first gas channel has a first gas outlet. The first gas injector also includes a second gas channel extending through the body of the first gas injector, wherein the second gas channel has a second gas outlet. The second gas channel includes a first portion, and a second portion branching off from an end of the first portion, wherein the second portion is disposed at an angle with respect to the first portion, and the first gas injector is operable to rotate about a longitudinal center axis of the body of the first gas injector.

公开(公告)号：US20230377871A1

公开(公告)日：2023-11-23

申请号：US18228201

申请日：2023-07-31

申请人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

发明人： Po-Wei WANG ,  Chao-Hsing LAI ,  Hsiao-Feng LU

IPC分类号： H01L21/02 ,  C23C16/455

CPC分类号： H01L21/02052 ,  C23C16/45565 ,  H01L21/02057

摘要： A method, comprising: providing an adjustable distributor assembly disposed within a showerhead configured to provide selectively adjustable openings through which a cleaning material passes; determining an initial value of a configurable parameter of an adjustable distributor assembly; performing an amount/thickness measurement of a layer including polymeric residues and metal oxide deposits at a cleaning surface of a wafer by a monitoring device; determining whether a variation in the amount/thickness measurement is within an acceptable range; and in response to the variation in the amount/thickness measurement that is not within the acceptable range, automatically adjusting the configurable parameter of the adjustable distributor assembly to set the variation in the amount/thickness measurement within the acceptable range so that the cleaning material that passes through the selectively adjustable openings of the adjustable distributor assembly reduces metal oxide deposits.

公开(公告)号：US20220380886A1

公开(公告)日：2022-12-01

申请号：US17330946

申请日：2021-05-26

申请人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

发明人： PO-WEI WANG ,  Chao-Hsing LAI

IPC分类号： C23C14/35 ,  C23C14/50 ,  C23C14/34 ,  C23C14/00

摘要： Embodiments of the present disclosure provide a substrate processing system. In one embodiment, the system includes a chamber, a target disposed within the chamber, a magnetron disposed proximate the target, a pedestal disposed within the chamber, and a first gas injector disposed at a sidewall of the chamber, the first gas injector having a movable gas outlet.