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    Method of making IC card
    1.
    发明授权
    Method of making IC card 失效
    IC卡制作方法

    公开(公告)号：US5520863A

    公开(公告)日：1996-05-28

    申请号：US348487

    申请日：1994-12-02

    Applicant: Katsunori Ochi ,  Syojiro Kodai ,  Tuguo Kurisu ,  Osamu Murakami ,  Makoto Kobayashi

    Inventor： Katsunori Ochi ,  Syojiro Kodai ,  Tuguo Kurisu ,  Osamu Murakami ,  Makoto Kobayashi

    IPC: B42D15/10 ,  G06K19/07 ,  G06K19/077 ,  H05K3/28 ,  B29C44/06 ,  B29C44/12

    CPC classification number: H05K3/284 ,  G06K19/077 ,  G06K19/07745 ,  H01L2924/0002 ,  Y10S425/812

    Abstract: A method for producing an IC card including filling a confined space with a mixture including a foaming resin, the mixture having not been foamed yet, the space being confined by a frame having cut-out portions on inner edges and at least one through-hole passing through the frame in the lateral direction between the inside and the outside of the frame, a circuit board on which functional components are mounted and having edges fitted to one of the cut-out portions of the frame so that the surface of the circuit board on which functional components are mounted faces inward, the frame and the circuit board forming a substantially flat outer surface, and a thin plate having edges fitted to another of the cut-out portions of the frame with the thin plate opposing the circuit board, the frame and the thin plate forming a substantially flat outer surface; foaming the mixture at a predetermined temperature for a predetermined time, thus filling the confined space with foamed resin, and thus making the foamed resin a structural member having mechanical strength, molding the frame, the circuit board, and the thin plate into one body; and removing excess foamed resin from the through-hole in the frame.

    Abstract translation: 一种用于制造IC卡的方法，包括用包含发泡树脂的混合物填充密闭空间，所述混合物尚未发泡，所述空间被具有内边缘上的切口部分的框架和至少一个通孔 在框架的内部和外部之间沿横向方向穿过框架，电路板，功能部件安装在该电路板上，并且边缘装配到框架的一个切口部分，使得电路板的表面 其中功能部件被安装在其上，框架和电路板形成基本上平坦的外表面，以及薄板，其边缘装配到框架的另一个切口部分，薄板与电路板相对， 框架和薄板形成基本平坦的外表面; 在预定温度下将混合物发泡预定时间，由此用泡沫树脂填充密闭空间，从而使发泡树脂具有机械强度的结构件，将框架，电路板和薄板模制成一体; 并从框架中的通孔中除去多余的发泡树脂。

    Production method for an IC card and its IC card
    3.
    发明授权
    Production method for an IC card and its IC card 失效
    IC卡带有一个暴露的电极端子面

    公开(公告)号：US5272374A

    公开(公告)日：1993-12-21

    申请号：US727448

    申请日：1991-07-09

    Applicant: Syojiro Kodai ,  Katsunori Ochi ,  Osamu Murakami

    Inventor： Syojiro Kodai ,  Katsunori Ochi ,  Osamu Murakami

    IPC: B42D15/10 ,  B29C45/14 ,  G06K19/077 ,  H01L23/02 ,  H01L23/12

    CPC classification number: G06K19/07724 ,  B29C45/14647 ,  G06K19/07745 ,  H01L2224/48091

    Abstract: An IC card comprises a card board having first and second major surfaces and a semiconductor module having an electrode terminal face. The semiconductor module is mounted in the card board, so that the electrode terminal face is exposed onto the first major surface of the card board. The card board comprises a board frame and a resin which is molded inside the board frame. Part of the semiconductor module surface which is opposite to the electrode terminal face, is covered with the resin.

    Abstract translation: IC卡包括具有第一和第二主表面的卡板和具有电极端子面的半导体模块。 半导体模块安装在卡板中，使得电极端子面暴露在卡板的第一主表面上。 卡板包括板框架和模制在板框内的树脂。 与电极端子面相对的半导体模块表面的一部分被树脂覆盖。

    Production method for an IC card
    4.
    发明授权
    Production method for an IC card 失效
    IC卡的制作方法

    公开(公告)号：US5498388A

    公开(公告)日：1996-03-12

    申请号：US384218

    申请日：1995-02-06

    Applicant: Syojiro Kodai ,  Katsunori Ochi ,  Osamu Murakami

    Inventor： Syojiro Kodai ,  Katsunori Ochi ,  Osamu Murakami

    IPC: B42D15/10 ,  B29C45/14 ,  G06K19/077 ,  B29C70/70

    CPC classification number: G06K19/07724 ,  B29C45/14647 ,  G06K19/07745 ,  H01L2224/48091

    Abstract: An IC card production method includes the steps of mounting a card board (12) having a through opening onto a lower mold (16) of molding dies (15), mounting a semiconductor module (2) onto the opening of said card board (12), tightening an upper die (17) of the molding dies (15) having a gate (19) onto a lower die (16), and molding by injecting resin (13) into the opening from the gate (19) in a state in which only an electrode terminal face (7) for external connection of the semiconductor module (2) is exposed. The IC card includes a card board (12) having a through opening, a semiconductor module (2) mounted onto this opening, and a molded resin (13) injected into said opening so that the resin moding is formed under such condition that only an electrode terminal face for external connection (7) of said semiconductor module (2) is made to expose.

    Abstract translation: IC卡制造方法包括以下步骤：将具有通孔的卡板（12）安装到成型模具（15）的下模具（16）上，将半导体模块（2）安装到所述卡板（12）的开口 ），将具有栅极（19）的成型模具（15）的上模具（17）紧固到下模具（16）上，并且以一种状态从浇口（19）将树脂（13）注入到开口中成型 其中仅露出用于半导体模块（2）的外部连接的电极端子面（7）。 IC卡包括具有通孔的卡板（12），安装在该开口上的半导体模块（2）和注入到所述开口中的模制树脂（13），使得树脂模制形成在仅仅 使所述半导体模块（2）的外部连接（7）的电极端子面露出。

    Method of manufacturing IC card
    5.
    发明授权
    Method of manufacturing IC card 失效
    IC卡制造方法

    公开(公告)号：US5346576A

    公开(公告)日：1994-09-13

    申请号：US85054

    申请日：1993-07-02

    Applicant: Makoto Kobayashi ,  Syojiro Kodai ,  Katsunori Ochi

    Inventor： Makoto Kobayashi ,  Syojiro Kodai ,  Katsunori Ochi

    IPC: B42D15/10 ,  G06K19/077 ,  H01L29/06 ,  B32B31/00 ,  B29C65/02

    CPC classification number: G06K19/07745 ,  H01L29/0657 ,  H01L2924/0002 ,  Y10S428/915 ,  Y10S428/916 ,  Y10T428/24322 ,  Y10T428/24826 ,  Y10T428/24917

    Abstract: In an IC card and a manufacturing method therefor, an adhesive is applied between core layers in the vicinity of an opening in which an IC module is placed. The core sheet layers held between adhesive layers can easily be deformed when heat and pressure are applied. Therefore, a gap formed between the card substrate and the IC module is filled. Furthermore, the gap from the IC module is narrower at the corners of the IC module than conventionally shaped openings. As a result, gaps at the corners of the IC module after integral molding are prevented. Therefore, the gap between the IC module and the card substrate can be reliably filled during molding.

    Abstract translation: 在IC卡及其制造方法中，在放置IC模块的开口附近的芯层之间施加粘合剂。 当施加热和压力时，保持在粘合剂层之间的芯片层可以容易地变形。 因此，填充卡片基板和IC模块之间形成的间隙。 此外，IC模块的间隙比常规成形的开口在IC模块的拐角处更窄。 结果，防止一体成型后IC模块的拐角处的间隙。 因此，可以在成型时可靠地填充IC模块与卡片基板之间的间隙。

    IC card
    9.
    发明授权
    IC card 失效
    IC卡

    公开(公告)号：US5250341A

    公开(公告)日：1993-10-05

    申请号：US648511

    申请日：1991-01-30

    Applicant: Makoto Kobayashi ,  Syojiro Kodai ,  Katsunori Ochi

    Inventor： Makoto Kobayashi ,  Syojiro Kodai ,  Katsunori Ochi

    IPC: B42D15/10 ,  G06K19/077 ,  H01L29/06 ,  B32B3/00

    CPC classification number: G06K19/07745 ,  H01L29/0657 ,  H01L2924/0002 ,  Y10S428/915 ,  Y10S428/916 ,  Y10T428/24322 ,  Y10T428/24826 ,  Y10T428/24917

    Abstract: In an IC card and a manufacturing method therefor, an adhesive is applied between core layers in the vicinity of an opening in which an IC module is placed. The core sheet layers held between adhesive layers can easily be deformed when heat and pressure are applied. Therefore, a gap formed between the card substrate and the IC module is filled. Furthermore, the gap from the IC module is narrower at the corners of the IC module than conventionally shaped openings. As a result, gaps at the corners of the IC module after integral molding are prevented. Therefore, the gap between the IC module and the card substrate can be reliably filled during molding.

    Abstract translation: 在IC卡及其制造方法中，在放置IC模块的开口附近的芯层之间施加粘合剂。 当施加热和压力时，保持在粘合剂层之间的芯片层可以容易地变形。 因此，填充卡片基板和IC模块之间形成的间隙。 此外，IC模块的间隙比常规成形的开口在IC模块的拐角处更窄。 结果，防止一体成型后IC模块的拐角处的间隙。 因此，可以在成型时可靠地填充IC模块与卡片基板之间的间隙。

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