Abstract:
Disclosed is an electromagnetic wave interference (EMI)/radio frequency interference (RFI) shielding resin composite material including (A) a thermoplastic polymer resin, (B) a tetrapod whisker, and (C) a low melting point metal.
Abstract:
An electrically insulating highly thermally conductive resin composition includes (A) 100 parts by weight of a polyamide-based resin, and (B) 10 to 80 parts by weight of a long metal fiber including a metal comprising copper, nickel, aluminum, iron, chromium, molybdenum, an alloys thereof, or a combination thereof. The electrically insulating highly thermally conductive resin composition can exhibit high hardness and high strength as well as excellent electrically insulating and thermal conductivity properties, and can be useful for various molded products requiring high thermal conductivity and excellent mechanical characteristics.
Abstract:
Disclosed are a multi-functional resin composite material including (A) a thermoplastic resin, (B) a nickel-coated carbon fiber, (C) a carbon nanotube, and (D) an inorganic material having a volume resistance of about 10−3 Ω·m or less and a relative permeability of about 5000 or more, and a molded product fabricated using the same.
Abstract:
An apparatus and method for estimating frequency offset in a mobile terminal are provided. The method includes collecting information on the locations of a base station and the mobile terminal; calculating a moving speed of the mobile terminal using the collected location information; and estimating the frequency offset using the calculated moving speed.
Abstract:
A liquid crystal display includes a first substrate and a second substrate which face each other and each include a display area and a peripheral area, a liquid crystal layer in the display areas and between the first substrate and the second substrate, and a conductive sealant combining the first substrate and the second substrate. The first substrate includes a common electrode in the display and peripheral areas of the first substrate. The second substrate includes a first and signal lines in the peripheral area of the second substrate, a first insulating layer on the first signal line and the second signal line, and a conductor on the first insulating layer in the peripheral area and connected to the first signal line through a contact hole. The common electrode includes a cutout corresponding to the conductor, and the cutout is at a corner of the display areas.
Abstract:
A liquid crystal display includes a first substrate including a display area and a fan-out area, a plurality of pixels disposed in the display area; a dam disposed in the fan-out area, and a plurality of display signal lines disposed on the first substrate, where the plurality of display signal lines is connected to the plurality of pixels in the display area, the plurality of display signal lines includes a plurality of wiring units in the fan-out area, the dam is disposed in a dummy area between the plurality of wiring units, and a shape of the dam is different from a shape of the plurality of wiring units.
Abstract:
A capacitor includes an object or a substrate including an insulation layer having an opening, an electrode structure having conductive patterns, a dielectric layer and an upper electrode. The electrode structure may have a first conductive pattern including metal and a second conductive pattern including metal oxide generated from the first conductive pattern. The first conductive pattern may fill the opening and may protrude over the insulation layer. The second conductive pattern may extend from the first conductive pattern. The electrode structure may additionally include a third conductive pattern disposed on the second conductive pattern. The capacitor including the electrode structure may ensure improved structural stability and electrical characteristics.
Abstract:
A method for fabricating a semiconductor device with a buried gate includes: etching a substrate to form a plurality of trenches; forming a plurality of buried gates that fill lower portions of the trenches; forming a plurality of sealing layers that gap-fill upper portions of the trenches and have protrusions higher than a top surface of the substrate; forming an inter-layer insulation layer over the whole surface of the substrate including the sealing layers; and etching the inter-layer insulation layer to form a contact hole that is aligned with a space between the protrusions of the sealing layers.