公开(公告)号：US11375615B2

公开(公告)日：2022-06-28

申请号：US15753017

申请日：2016-08-06

申请人： SUMITOMO ELECTRIC INDUSTRIES, LTD. ,  SUMITOMO ELECTRIC PRINTED CIRCUITS, INC. ,  SUMITOMO ELECTRIC FINE POLYMER, INC.

发明人： Yuichiro Yamanaka ,  Yoshio Oka ,  Satoshi Kiya ,  Yoshifumi Uchita ,  Makoto Nakabayashi

IPC分类号： H05K3/38 ,  H05K1/03 ,  B32B15/08 ,  B32B15/088

摘要： A substrate for a printed circuit board according to an embodiment of the present invention includes a base film and a metal layer disposed on at least one of surfaces of the base film. In the substrate for a printed circuit board, an amount of nitrogen present per unit area, the amount being determined on the basis of a peak area of a N1s spectrum in XPS analysis of a surface of the base film exposed after removal of the metal layer by etching with an acidic solution, is 1 atomic % or more and 10 atomic % or less.

公开(公告)号：US12081195B2

公开(公告)日：2024-09-03

申请号：US17422769

申请日：2019-01-18

申请人： Sumitomo Electric Industries, Ltd.

发明人： Hirohisa Saito ,  Shigeru Nakayama ,  Yoshihiro Imagawa ,  Keiichiro Geshi ,  Yuichiro Yamanaka

IPC分类号： H03H9/25 ,  C04B35/443 ,  H03H9/02 ,  H03H9/64

CPC分类号： H03H9/25 ,  C04B35/443 ,  H03H9/02559 ,  H03H9/02574 ,  H03H9/6413

摘要： Provided is a joined body including a piezoelectric substrate and a polycrystalline spinel substrate provided on one main surface of the piezoelectric substrate, wherein the polycrystalline spinel substrate has a porosity of 0.005% or more and 0.6% or less.