-
公开(公告)号：US10340886B2
公开(公告)日：2019-07-02
申请号：US15317563
申请日：2016-04-26
发明人： Keiichiro Geshi , Shigeru Nakayama
IPC分类号： H03H9/25 , C04B35/111 , B32B9/00 , H03H9/02 , H03H9/05 , H03H9/08 , H03H3/08 , B32B18/00 , C04B35/053 , C04B35/057 , C04B35/14 , C04B35/185 , C04B35/195 , C04B35/443 , C04B35/46 , C04B35/495 , C04B35/565 , C04B35/581 , C04B35/587
摘要： A ceramic substrate is formed of a polycrystalline ceramic and has a supporting main surface. The supporting main surface has a roughness of 0.01 nm or more and 3.0 nm or less in terms of Sa. The number of projections and depressions with a height of 1 nm or more in a square region with 50 μm sides on the supporting main surface is less than 5 on average, and the number of projections and depressions with a height of 2 nm or more in the square region is less than 1 on average.
-
公开(公告)号：US11545356B2
公开(公告)日：2023-01-03
申请号：US16091241
申请日：2017-04-05
IPC分类号： B32B15/04 , H01L21/02 , C30B33/06 , C04B37/00 , C30B29/40 , H01L21/762 , C04B35/117 , C04B35/185 , B32B18/00 , C04B37/02
摘要： Provided is a polycrystalline ceramic substrate to be bonded to a compound semiconductor substrate with a bonding layer interposed therebetween, wherein at least one of relational expression (1) 0.7
-
公开(公告)号：US12081195B2
公开(公告)日：2024-09-03
申请号：US17422769
申请日：2019-01-18
IPC分类号： H03H9/25 , C04B35/443 , H03H9/02 , H03H9/64
CPC分类号： H03H9/25 , C04B35/443 , H03H9/02559 , H03H9/02574 , H03H9/6413
摘要： Provided is a joined body including a piezoelectric substrate and a polycrystalline spinel substrate provided on one main surface of the piezoelectric substrate, wherein the polycrystalline spinel substrate has a porosity of 0.005% or more and 0.6% or less.
-
-
搜索结果
3 条记录 (耗时 0.012 秒)
