摘要:
In different embodiments, a method is provided for processing at least one crystalline Silicon-wafer or a Solar-cell wafer. The method may include: a movement of the wafer with respect to a laser producing a laser beam; and therefore the formation of a laser channel in the wafer by means of a laser beam, wherein a thermal budget applied on the wafer by means of the laser beam is reduced in the peripheral region of the wafer, wherein the peripheral region includes a wafer edge, through which the laser beam exits the wafer after formation of the laser channel.
摘要:
A bifacial photovoltaic module with at least one bifacial solar cell is provided. The at least one bifacial solar cell includes a substrate with a front-side and a rear-side. The front-side is the light incident side and the rear-side has rear-side contact structure. The rear-side contact structure includes a plurality of electrically conductive contact fingers, which have a first metal, a plurality of solder pads electrically connected to the contact fingers. The solder pads have a top. The solder pads have a second metal, which is different from the first metal. The rear-side contact structure further includes several cell connectors electrically connected to the solder pads. The top of the solder pads is free from the contact fingers in an area along one direction. The cell connectors are disposed planar on or above this area.
摘要:
A method for contacting and connecting solar cells, according to which at least one electrode is formed by at least one wire conductor, and including the following steps: positioning a continuous wire conductor so that the continuous wire conductor extends across a plurality of solar cells, interrupting the electrodes at the positions required for the connection, and contacting the solar cells and electrodes.
摘要:
In various embodiments, a solar cell screen-printing composition is provided, comprising aluminum; and silicon; the percentage by mass of silicon lying in a range from 5% to 95% of the sum of the percentages by mass of silicon and aluminum.
摘要:
In various embodiments, a solar cell screen-printing composition is provided, comprising aluminum; and silicon; the percentage by mass of silicon lying in a range from 5% to 95% of the sum of the percentages by mass of silicon and aluminum.
摘要:
A method for contacting and connecting solar cells, according to which at least one electrode is formed by at least one wire conductor, and including the following steps: positioning a continuous wire conductor so that the continuous wire conductor extends across a plurality of solar cells, interrupting the electrodes at the positions required for the connection, and contacting the solar cells and electrodes.
摘要:
In different embodiments, a method is provided for processing at least one crystalline Silicon-wafer or a Solar-cell wafer. The method may include: a movement of the wafer with respect to a laser producing a laser beam; and therefore the formation of a laser channel in the wafer by means of a laser beam, wherein a thermal budget applied on the wafer by means of the laser beam is reduced in the peripheral region of the wafer, wherein the peripheral region includes a wafer edge, through which the laser beam exits the wafer after formation of the laser channel.
摘要:
A solar cell combination having at least two independent electrodes, in which at least one first electrode is formed by at least one first wire conductor that first spans a plurality of solar cells, and in which the first and the second electrodes are contacted with each other, and the first and/or second electrode is disconnected at the positions required for the connection.
摘要:
A bifacial photovoltaic module with at least one bifacial solar cell is provided. The at least one bifacial solar cell includes a substrate with a front-side and a rear-side. The front-side is the light incident side and the rear-side has rear-side contact structure. The rear-side contact structure includes a plurality of electrically conductive contact fingers, which have a first metal, a plurality of solder pads electrically connected to the contact fingers. The solder pads have a top. The solder pads have a second metal, which is different from the first metal. The rear-side contact structure further includes several cell connectors electrically connected to the solder pads. The top of the solder pads is free from the contact fingers in an area along one direction. The cell connectors are disposed planar on or above this area.