CIRCUIT SYSTEMS
    1.
    发明公开
    CIRCUIT SYSTEMS 审中-公开

    公开(公告)号:US20240312927A1

    公开(公告)日:2024-09-19

    申请号:US18671764

    申请日:2024-05-22

    Applicant: Snap Inc.

    Abstract: Various circuit board systems and methods of use and manufacture thereof are disclosed. A circuit board system can have a first circuit board including a substrate and a first component susceptible to electromagnetic interference carried by the substrate. The system can also include a second circuit board including a second substrate, and a shield engaged to the substrate of the first component, the shield at least partially covering the first component and being configured to protect the first component from electromagnetic interference, wherein the shield couples the substrate of the first circuit board to the substrate of the second circuit board.

    THERMAL ARCHITECTURE FOR SMART GLASSES

    公开(公告)号:US20220357577A1

    公开(公告)日:2022-11-10

    申请号:US17737241

    申请日:2022-05-05

    Applicant: Snap Inc.

    Abstract: A method of dissipating heat generated by imaging devices and processing devices of a wearable electronic eyewear device includes providing a first heat sink thermally connecting the imaging devices to a frame of the eyewear device to sink heat to the frame and providing a second heat sink thermally connecting the processing devices to respective temples of the eyewear device to sink heat to the respective temples. The first and second heat sinks are thermally insulated from each other to direct the heat to different portions of the eyewear device. The processing devices may include a first co-processor disposed in a first temple connected to a first end of the frame and a second co-processor disposed in a second temple connected to a second end of the frame. The resulting eyewear device spreads the heat from heat generating devices over a larger area to minimize overall heating.

    CIRCUIT SYSTEMS
    5.
    发明申请
    CIRCUIT SYSTEMS 审中-公开

    公开(公告)号:US20200312785A1

    公开(公告)日:2020-10-01

    申请号:US16903016

    申请日:2020-06-16

    Applicant: Snap Inc.

    Abstract: Various circuit board systems and methods of use and manufacture thereof are disclosed. A circuit board system can have a first circuit board including a substrate and a first component susceptible to electromagnetic interference carried by the substrate. The system can also include a second circuit board including a second substrate, and a shield engaged to the substrate of the first component, the shield at least partially covering the first component and being configured to protect the first component from electromagnetic interference, wherein the shield couples the substrate of the first circuit board to the substrate of the second circuit board.

    Eyewear device hinge assembly
    6.
    发明授权

    公开(公告)号:US12204174B2

    公开(公告)日:2025-01-21

    申请号:US18196960

    申请日:2023-05-12

    Applicant: Snap Inc.

    Abstract: A hinge assembly mounted on a housing of form part of an electronic device includes a metal hinge base extending through a mounting hole in a wall of the housing, the hinge base being connected in heat transfer relationship to a metal anchor plate on an inner side of the housing wall. The anchor plate additionally serves as a mounting base for heat-generating electronics inside the housing, the heat-generating electronics being in heat transfer relationship with the anchor plate, so that the anchor plate and the hinge base together form part of a heat transfer path conducting heat from the interior of the housing to an exterior heatsink provided be and external device component.

    CIRCUIT SYSTEMS
    8.
    发明申请

    公开(公告)号:US20210313279A1

    公开(公告)日:2021-10-07

    申请号:US17106907

    申请日:2020-11-30

    Applicant: Snap Inc.

    Abstract: Various circuit board systems and methods of use and manufacture thereof are disclosed. A circuit board system can have a first circuit board including a substrate and a first component susceptible to electromagnetic interference carried by the substrate. The system can also include a second circuit board including a second substrate, and a shield engaged to the substrate of the first component, the shield at least partially covering the first component and being configured to protect the first component from electromagnetic interference, wherein the shield couples the substrate of the first circuit board to the substrate of the second circuit board.

    Heat management for electronic devices

    公开(公告)号:US10928658B1

    公开(公告)日:2021-02-23

    申请号:US16037844

    申请日:2018-07-17

    Applicant: Snap Inc.

    Abstract: Apparatuses and systems are disclosed and can include a case for eyewear having an eyewear body carrying onboard electronic components that comprise a heat source that generates heat during electrically powered operation is disclosed. The case can hold the eyewear when the eyewear are in a stowed position. The case can further include one or more supports to support the eyewear in the stowed position within the holding space. One or more heat sinks are integrated with the one or more supports. Each of the one or more heat sinks are thermally conductive coupled with a corresponding heat sink of the eyewear. A first heat conduction pathway is thermally connected to the one or more heat sinks and can extend into the case body to conduct heat from the heat source into the case with the eyewear supported in the stowed position.

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