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公开(公告)号:US20240312927A1
公开(公告)日:2024-09-19
申请号:US18671764
申请日:2024-05-22
Applicant: Snap Inc.
Inventor: Stephen Andrew Steger , Emily Lauren Clopp
IPC: H01L23/552 , H05K1/02 , H05K9/00
CPC classification number: H01L23/552 , H05K1/0216 , H05K9/0081 , H05K9/0024 , H05K9/0052 , H05K9/0071 , H05K2201/0707 , H05K2201/10371
Abstract: Various circuit board systems and methods of use and manufacture thereof are disclosed. A circuit board system can have a first circuit board including a substrate and a first component susceptible to electromagnetic interference carried by the substrate. The system can also include a second circuit board including a second substrate, and a shield engaged to the substrate of the first component, the shield at least partially covering the first component and being configured to protect the first component from electromagnetic interference, wherein the shield couples the substrate of the first circuit board to the substrate of the second circuit board.
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公开(公告)号:US20230204975A1
公开(公告)日:2023-06-29
申请号:US18115958
申请日:2023-03-01
Applicant: Snap Inc.
Inventor: Martin Mape , Douglas Wayne Moskowitz , Stephen Andrew Steger
CPC classification number: G02C5/001 , G02C5/146 , G02C11/10 , G02C9/00 , B29C45/14336 , B29D12/02 , G02C13/001
Abstract: A method of manufacturing a button-enabled housing assembly includes preforming a composite button component or insert having an elastically flexible button membrane that is mounted on a rigid frame, and thereafter molding a housing over the button insert. The composite button insert is formed in a co-molding operation and can include a rigid island in the flexible button membrane for supporting a cosmetic keycap.
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公开(公告)号:US20220357577A1
公开(公告)日:2022-11-10
申请号:US17737241
申请日:2022-05-05
Applicant: Snap Inc.
Inventor: Andrea Ashwood , Gerald Nilles , Patrick Timothy McSweeney Simons , Stephen Andrew Steger , Choonshin You
IPC: G02B27/01
Abstract: A method of dissipating heat generated by imaging devices and processing devices of a wearable electronic eyewear device includes providing a first heat sink thermally connecting the imaging devices to a frame of the eyewear device to sink heat to the frame and providing a second heat sink thermally connecting the processing devices to respective temples of the eyewear device to sink heat to the respective temples. The first and second heat sinks are thermally insulated from each other to direct the heat to different portions of the eyewear device. The processing devices may include a first co-processor disposed in a first temple connected to a first end of the frame and a second co-processor disposed in a second temple connected to a second end of the frame. The resulting eyewear device spreads the heat from heat generating devices over a larger area to minimize overall heating.
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公开(公告)号:US20210344140A1
公开(公告)日:2021-11-04
申请号:US17376507
申请日:2021-07-15
Applicant: Snap Inc.
IPC: H01R13/62 , H02J7/00 , H04B3/56 , H02J7/04 , G02C5/14 , G02C11/00 , H01L27/02 , H03K19/0185 , H02J7/34
Abstract: Methods and devices for wired charging and communication with a wearable device are described. In one embodiment, a symmetrical contact interface comprises a first contact pad and a second contact pad, and particular wired circuitry is coupled to the first and second contact pad to enable charging as well as receive and transmit communications via the contact pads as part of various device states.
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公开(公告)号:US20200312785A1
公开(公告)日:2020-10-01
申请号:US16903016
申请日:2020-06-16
Applicant: Snap Inc.
Inventor: Stephen Andrew Steger , Emily Lauren Clopp
IPC: H01L23/552 , H05K1/02 , H05K9/00
Abstract: Various circuit board systems and methods of use and manufacture thereof are disclosed. A circuit board system can have a first circuit board including a substrate and a first component susceptible to electromagnetic interference carried by the substrate. The system can also include a second circuit board including a second substrate, and a shield engaged to the substrate of the first component, the shield at least partially covering the first component and being configured to protect the first component from electromagnetic interference, wherein the shield couples the substrate of the first circuit board to the substrate of the second circuit board.
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公开(公告)号:US12204174B2
公开(公告)日:2025-01-21
申请号:US18196960
申请日:2023-05-12
Applicant: Snap Inc.
Inventor: Emily Lauren Clopp , Jun Lin , Douglas Wayne Moskowitz , Stephen Andrew Steger , Nicholas Daniel Streets
Abstract: A hinge assembly mounted on a housing of form part of an electronic device includes a metal hinge base extending through a mounting hole in a wall of the housing, the hinge base being connected in heat transfer relationship to a metal anchor plate on an inner side of the housing wall. The anchor plate additionally serves as a mounting base for heat-generating electronics inside the housing, the heat-generating electronics being in heat transfer relationship with the anchor plate, so that the anchor plate and the hinge base together form part of a heat transfer path conducting heat from the interior of the housing to an exterior heatsink provided be and external device component.
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公开(公告)号:US20220109230A1
公开(公告)日:2022-04-07
申请号:US17447965
申请日:2021-09-17
Applicant: Snap Inc.
Inventor: Andrea Ashwood , Patrick Kusbel , Jun Lin , Douglas Wayne Moskowitz , Ugur Olgun , Russell Douglas Patton , Patrick Timothy McSweeney Simons , Stephen Andrew Steger
IPC: H01Q1/27 , G02C11/00 , H01Q1/48 , H01Q9/04 , H05K1/02 , H05K1/14 , H01Q1/02 , H01Q1/38 , H05K7/20
Abstract: An eyewear device has an antenna system having at least one element which contributes to wireless signal transmission, and which is thermally connected to a heat-generating electronic component of the eyewear device to serve as a heat sink for the electronic component. A driven antenna element and/or a plurality of PCB extenders electrically connected to a PCB ground plane can thus be employed for both signal transmission and heat management.
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公开(公告)号:US20210313279A1
公开(公告)日:2021-10-07
申请号:US17106907
申请日:2020-11-30
Applicant: Snap Inc.
Inventor: Stephen Andrew Steger , Emily Lauren Clopp
IPC: H01L23/552 , H05K1/02 , H05K9/00
Abstract: Various circuit board systems and methods of use and manufacture thereof are disclosed. A circuit board system can have a first circuit board including a substrate and a first component susceptible to electromagnetic interference carried by the substrate. The system can also include a second circuit board including a second substrate, and a shield engaged to the substrate of the first component, the shield at least partially covering the first component and being configured to protect the first component from electromagnetic interference, wherein the shield couples the substrate of the first circuit board to the substrate of the second circuit board.
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公开(公告)号:US11081836B2
公开(公告)日:2021-08-03
申请号:US16875485
申请日:2020-05-15
Applicant: Snap Inc.
IPC: H02J7/00 , H01R13/62 , H04B3/56 , H02J7/04 , G02C5/14 , G02C11/00 , H01L27/02 , H03K19/0185 , H02J7/34 , H04B3/54
Abstract: Methods and devices for wired charging and communication with a wearable device are described. In one embodiment, a symmetrical contact interface comprises a first contact pad and a second contact pad, and particular wired circuitry is coupled to the first and second contact pad to enable charging as well as receive and transmit communications via the contact pads as part of various device states.
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公开(公告)号:US10928658B1
公开(公告)日:2021-02-23
申请号:US16037844
申请日:2018-07-17
Applicant: Snap Inc.
Inventor: Andrea Ashwood , Ashutosh Y. Shukla , Stephen Andrew Steger
IPC: G02C11/00 , H05K7/20 , H05K5/00 , G02C5/22 , G02C5/14 , G02C11/08 , G02C5/00 , G02B27/01 , G02C5/18
Abstract: Apparatuses and systems are disclosed and can include a case for eyewear having an eyewear body carrying onboard electronic components that comprise a heat source that generates heat during electrically powered operation is disclosed. The case can hold the eyewear when the eyewear are in a stowed position. The case can further include one or more supports to support the eyewear in the stowed position within the holding space. One or more heat sinks are integrated with the one or more supports. Each of the one or more heat sinks are thermally conductive coupled with a corresponding heat sink of the eyewear. A first heat conduction pathway is thermally connected to the one or more heat sinks and can extend into the case body to conduct heat from the heat source into the case with the eyewear supported in the stowed position.
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