公开(公告)号：US20230346275A1

公开(公告)日：2023-11-02

申请号：US18025856

申请日：2021-05-28

Applicant: Shimadzu Corporation

Inventor： Toru MIZUMOTO ,  Akina ICHIOKA ,  Masafumi FURUTA ,  Koichi MURATA

IPC: A61B5/16 ,  A61B5/369 ,  A61B5/024

CPC classification number: A61B5/163 ,  A61B5/369 ,  A61B5/024

Abstract: A sensibility measuring method includes measuring, based on a measurement item which corresponds to each of evaluation objects (50), a set of biological information (20), the set each derived from a subject (60) while using each of the evaluation objects (50) on a trial basis, and acquiring an evaluation result (80) for each of the evaluation objects (50), the evaluation result (80) including identification information that enables identification of a rank order in which the evaluation objects (50) are compared with each other, based on the measured set of biological information (20).

公开(公告)号：US20170058394A1

公开(公告)日：2017-03-02

申请号：US15210225

申请日：2016-07-14

Applicant: Shimadzu Corporation

Inventor： Akina ICHIOKA ,  Toshinori YOSHIMUTA ,  Satoshi TOKUDA ,  Naoki YOSHIOKA ,  Satoko UENO ,  Satoru OZAKI

IPC: C23C14/20 ,  H01J37/32 ,  C23C14/50 ,  C23C14/34 ,  H01J37/34

CPC classification number: H01J37/32715 ,  C23C14/34 ,  C23C14/564 ,  C23C16/4401 ,  C23C16/5096 ,  H01J37/34 ,  H01J37/3426

Abstract: A film formation device for forming a metal thin film on a polycarbonate work molded by a resin molding machine, comprises: a film former including a chamber configured to house the work, and a sputtering electrode including a target material and disposed in the chamber; and a carrier configured to carry the work molded by the resin molding machine from the resin molding machine to the chamber within such a short time period that no moisture adheres to a surface of the work.

Abstract translation: 一种用于在由树脂成形机成型的聚碳酸酯工件上形成金属薄膜的成膜装置，包括：成膜装置，其包括被构造成容纳所述工件的室，以及包括目标材料并设置在所述室中的溅射电极; 以及载体，其被构造成在如此短的时间内将由树脂模制机成型的工件从树脂模塑机运送到腔室，以使得湿气不粘附到工件的表面。

公开(公告)号：US20170067142A1

公开(公告)日：2017-03-09

申请号：US15115563

申请日：2015-01-20

Applicant: Shimadzu Corporation

Inventor： Akina ICHIOKA ,  Toshinori YOSHIMUTA ,  Satoshi TOKUDA ,  Daisuke IMAI ,  Satoru OZAKI ,  Yuu TOKUTAKE

IPC: C23C14/02 ,  G02B5/08 ,  C23C16/505 ,  C23C14/20 ,  C23C16/40

CPC classification number: C23C14/024 ,  C22C21/00 ,  C23C14/205 ,  C23C16/402 ,  C23C16/505 ,  G02B5/0808

Abstract: Provided is a structure configured such that even when resin, such as methacryl resin, exhibiting a low adhesion to a metal thin film is used, the resin and the metal thin film are firmly stacked in close contact with each other, and a film formation method capable of manufacturing a structure in which a metal thin film is, with a high adhesion, formed on a resin work exhibiting a low adhesion to the metal thin film, wherein the structure is configured such that an Al thin film 102 is, by sputtering, formed on a work W made of methacryl resin to form a stack of the work W and the Al thin film 102, and has a mixed region 101 of Al, Si, O, and C between the work W and the Al thin film 102. In the mixed region 101, Al is covalently bound to any one of Si, O, and C, or Al, Si, O, and C form a diffusion mixed layer.

Abstract translation: 提供一种构造成使得即使使用与金属薄膜具有低粘合性的树脂（例如甲基丙烯酸树脂），树脂和金属薄膜彼此紧密地层叠，并且成膜方法 能够制造在与金属薄膜具有低粘合性的树脂工件上形成金属薄膜具有高粘附性的结构，其中该结构被构造成使得Al薄膜102通过溅射， 形成在由甲基丙烯酸树脂制成的工件W上以形成工件W和Al薄膜102的堆叠，并且在工件W和Al薄膜102之间具有Al，Si，O和C的混合区域101。 在混合区域101中，Al与Si，O和C中的任一种共价结合，或Al，Si，O和C形成扩散混合层。