公开(公告)号：US20100203835A1

公开(公告)日：2010-08-12

申请号：US12513242

申请日：2007-11-02

申请人： Seung-Moon Ryu ,  Wan-Gyu Ju ,  Hae-Young Cho ,  Jae-Hyun Eom

发明人： Seung-Moon Ryu ,  Wan-Gyu Ju ,  Hae-Young Cho ,  Jae-Hyun Eom

IPC分类号： H04B7/00

CPC分类号： H04W56/0015 ,  H04L12/189 ,  H04W4/06 ,  H04W84/18

摘要： In wireless devices for transmitting/receiving at least one of broadcasting, communication and controlling, a wireless network protocol transmits repeatedly data structure with a certain period in a unit of the same cycle, and maintains synchronization of the devices in a unit of the same cycle. As a result, a frequency hopping is performed in a unit of a cycle. Here, length of the cycle is set to below 20 msec so that a buffer used for transmitting/receiving a broadcasting signal and a voice/data communication has length of below 20 msec. Cycles form a network cycle. Control frames included in the cycles in the network cycle are differently assigned in accordance with their use, and so the control frames may be used for various controls. A payload frame in the cycle used by a user may be set freely in the range of length of the cycle. In addition, the user may set optionally transmission direction, transmission velocity, transmission output power, etc in a unit of a frame and use the buffer in a unit of the frame. As a result, a user interface may be set simply.

摘要翻译： 在用于发送/接收广播，通信和控制中的至少一个的无线设备中，无线网络协议以相同周期的单位的特定周期重复发送数据结构，并且以相同周期的单元维护设备的同步 。 结果，以循环为单位进行跳频。 这里，周期的长度被设定为低于20毫秒，使得用于发送/接收广播信号和语音/数据通信的缓冲器具有低于20毫秒的长度。 周期形成网络周期。 包括在网络周期中的周期中的控制帧根据其使用被不同地分配，因此控制帧可以用于各种控制。 用户使用的循环中的有效载荷帧可以在循环的长度范围内自由设定。 此外，用户可以以帧为单位可选地设置传输方向，传输速度，传输输出功率等，并以帧为单位使用缓冲器。 结果，可以简单地设置用户界面。

公开(公告)号：US20090205862A1

公开(公告)日：2009-08-20

申请号：US12230101

申请日：2008-08-22

申请人： Hee-Bum Shin ,  Jeong-Ho Moon ,  Jae-Hyun Eom ,  Jee-Soo Mok

发明人： Hee-Bum Shin ,  Jeong-Ho Moon ,  Jae-Hyun Eom ,  Jee-Soo Mok

IPC分类号： H05K1/00 ,  H05K3/42

CPC分类号： H05K3/107 ,  H05K3/0023 ,  H05K3/045 ,  H05K3/423 ,  H05K3/426 ,  H05K2201/0376 ,  H05K2201/09563 ,  H05K2203/0353 ,  Y10T29/49126 ,  Y10T29/49165

摘要： A printed circuit board and a method of manufacturing the printed circuit board are disclosed. The printed circuit board can include a first insulation layer, a second insulation layer stacked over the first insulation layer, a circuit pattern and a via land buried in the second insulation layer, and a via made of a conductive material penetrating the first insulation layer and integrated with the via land. The circuit pattern and via land can be buried in the insulation material, and the circuit pattern, via land, and via can be formed simultaneously as an integrated structure. Thus, the electrical reliability between the wiring pattern and the via can be increased, the heat-releasing effect of the via can be improved, and the procedure for forming the circuit patterns, via lands, and vias can be simplified, allowing greater productivity in manufacturing the substrate.

摘要翻译： 公开了印刷电路板和印刷电路板的制造方法。 印刷电路板可以包括第一绝缘层，堆叠在第一绝缘层上的第二绝缘层，埋在第二绝缘层中的电路图案和通孔焊盘，以及由穿透第一绝缘层的导电材料制成的通孔，以及 与通路地相结合。 电路图案和通孔焊盘可以埋在绝缘材料中，并且电路图案，通过焊盘和通孔可以作为一体结构同时形成。 因此，可以提高布线图案和通孔之间的电可靠性，可以提高通孔的散热效果，并且可以简化通过焊盘和通孔形成电路图案的步骤，从而提高生产率 制造基板。

公开(公告)号：US08220149B2

公开(公告)日：2012-07-17

申请号：US12230101

申请日：2008-08-22

申请人： Hee-Bum Shin ,  Jeong-Ho Moon ,  Jae-Hyun Eom ,  Jee-Soo Mok

发明人： Hee-Bum Shin ,  Jeong-Ho Moon ,  Jae-Hyun Eom ,  Jee-Soo Mok

IPC分类号： H01K3/10

CPC分类号： H05K3/107 ,  H05K3/0023 ,  H05K3/045 ,  H05K3/423 ,  H05K3/426 ,  H05K2201/0376 ,  H05K2201/09563 ,  H05K2203/0353 ,  Y10T29/49126 ,  Y10T29/49165

摘要： A printed circuit board and a method of manufacturing the printed circuit board are disclosed. The printed circuit board can include a first insulation layer, a second insulation layer stacked over the first insulation layer, a circuit pattern and a via land buried in the second insulation layer, and a via made of a conductive material penetrating the first insulation layer and integrated with the via land. The circuit pattern and via land can be buried in the insulation material, and the circuit pattern, via land, and via can be formed simultaneously as an integrated structure. Thus, the electrical reliability between the wiring pattern and the via can be increased, the heat-releasing effect of the via can be improved, and the procedure for forming the circuit patterns, via lands, and vias can be simplified, allowing greater productivity in manufacturing the substrate.

摘要翻译： 公开了印刷电路板和印刷电路板的制造方法。 印刷电路板可以包括第一绝缘层，堆叠在第一绝缘层上的第二绝缘层，埋在第二绝缘层中的电路图案和通孔焊盘，以及由穿透第一绝缘层的导电材料制成的通孔，以及 与通路地相结合。 电路图案和通孔焊盘可以埋在绝缘材料中，并且电路图案，通过焊盘和通孔可以作为一体结构同时形成。 因此，可以提高布线图案和通孔之间的电可靠性，可以提高通孔的散热效果，并且可以简化通过焊盘和通孔形成电路图案的步骤，从而提高生产率 制造基板。