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    FLEXIBLE CONNECTION MEMBER AND ELECTRONIC DEVICE COMPRISING SAME
    1.
    发明申请
    FLEXIBLE CONNECTION MEMBER AND ELECTRONIC DEVICE COMPRISING SAME 有权

    公开(公告)号：US20210329784A1

    公开(公告)日：2021-10-21

    申请号：US17267651

    申请日：2019-08-09

    Applicant: Samsung Electronics Co., Ltd. ,  SI FLEX CO., LTD.

    Inventor： Sungwon PARK ,  Junghyub KIM ,  Hwanyoul JEONG ,  Seungyup LEE ,  Youngsun LEE ,  Hesuk JUNG ,  Eunseok HONG

    IPC: H05K1/11 ,  H05K1/02 ,  H05K1/14

    Abstract: Various embodiments disclosed in the disclosure relate to a flexible connection member and an electronic device comprising same, the flexible connection member having an RF line for signal transmission formed therein, wherein an impedance of the RF line is prevented from being changed even when a flexible printed circuit board is bent. According to one embodiment, a connection member may be provided, the connection member comprising, a first conductive layer including a first logic line, and a second conductive layer in contact with the first conductive layer and including a bonding sheet layer, wherein the second conductive layer includes, a second logic line formed on part of the second conductive layer, and an RF line formed on other part of the second conductive layer, the bonding sheet layer includes, the second conductive layer adhered over the second logic line and the RF line, a first insulating layer formed between the first conductive layer and the second conductive layer, and pins formed on one side of the first conductive layer and the second conductive layer and configured to be electrically connected to connection pins of an external module, and the second conductive layer includes at least one via formed between the second logic line and the RF line so as to energize between the layers included in the second conductive layer. Such a flexible connection member may vary according to embodiments, and an electronic device comprising the flexible connection member may be provided according to various other embodiments.

    PRINTED CIRCUIT BOARD WITH INCREASED DURABILITY IN BENDING REGION AND ELECTRONIC DEVICE INCLUDING SAME
    2.
    发明申请
    PRINTED CIRCUIT BOARD WITH INCREASED DURABILITY IN BENDING REGION AND ELECTRONIC DEVICE INCLUDING SAME 有权

    公开(公告)号：US20250071891A1

    公开(公告)日：2025-02-27

    申请号：US18944174

    申请日：2024-11-12

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Youngsun LEE ,  Sungwon PARK ,  Eunseck HONG

    IPC: H05K1/02 ,  H05K1/11 ,  H05K1/14

    Abstract: A printed circuit board is provided. The printed circuit board includes: an extending region extending along one direction, and a bending region configured to bend with respect to the extending region. The extending region and the bending region includes a non-conductive layer, a first conductive layer disposed on one surface of the non-conductive layer, a second conductive layer disposed on the other surface of the non-conductive layer, and at least one via hole penetrating the non-conductive layer, the first conductive layer, and the second conductive layer. In the bending region, a cross-sectional area of the via hole in contact with the first conductive layer is less than a cross-sectional area of the via hole in contact with the second conductive layer.

    ELECTRONIC DEVICE COMPRISING SENSOR PANEL
    3.
    发明申请
    ELECTRONIC DEVICE COMPRISING SENSOR PANEL 有权

    公开(公告)号：US20250060787A1

    公开(公告)日：2025-02-20

    申请号：US18937655

    申请日：2024-11-05

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Kyungho LEE ,  Youngsun LEE ,  Jiwon KIM ,  Kwanghee RYU ,  Jungchul AN ,  Chulhyo YOON ,  Seungki CHOI

    IPC: G06F1/16 ,  G06F3/0354 ,  G06F3/041 ,  H04M1/02

    Abstract: An electronic device may include: a first housing; a second housing; a hinge structure; a display; and a sensor panel, wherein the sensor panel comprises: a support layer which comprises a polymer inclusive material and is in contact with an adhesive material arranged on at least one of a first surface of the first housing and a third surface of the second housing; a shielding layer arranged on the support layer; a first insulating layer arranged on the shielding layer; a first conductive pattern arranged on the first insulating layer; a second insulating layer arranged on the first conductive pattern; a second conductive pattern arranged on the second insulating layer; and a third insulating layer arranged on the second conductive pattern and facing one surface of the display, wherein the thickness of at least one of the first insulating layer and the third insulating layer is greater than the thickness of the second insulating layer.

    RIGID-FLEXIBLE PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE INCLUDING SAME
    4.
    发明申请
    RIGID-FLEXIBLE PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE INCLUDING SAME 有权

    公开(公告)号：US20210251071A1

    公开(公告)日：2021-08-12

    申请号：US17171461

    申请日：2021-02-09

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Youngsun LEE ,  Byeongkeol KIM ,  Yeongjin LEE ,  Jongmin JEON ,  Jaeyoub JUNG ,  Eunseok HONG

    IPC: H05K1/02 ,  H05K3/46 ,  H05K1/18

    Abstract: The disclosure relates to a rigid-flexible printed circuit board and an electronic device including same. The electronic device may include: a housing; a first module disposed in one region of the housing; a second module disposed in an other region of the housing and spaced apart from the first module; and a rigid-flexible printed circuit board electrically connecting the first module and the second module, wherein the rigid-flexible printed circuit board includes: a rigid region; a flexible region coupled to the rigid region, wherein a part of the flexible region overlaps the rigid region; and a protective layer laminated on at least one of an upper end or a lower end of the flexible region to cover at least a part of a coupling portion of the rigid region and the flexible region by a designated numerical value, the coupling portion having a tensile strength equal to or greater than a designated strength based on the flexible region being bent. Various other embodiments are possible.

    PRINTED CIRCUIT BOARD WITH INCREASED DURABILITY IN BENDING REGION AND ELECTRONIC DEVICE INCLUDING SAME
    6.
    发明申请
    PRINTED CIRCUIT BOARD WITH INCREASED DURABILITY IN BENDING REGION AND ELECTRONIC DEVICE INCLUDING SAME 有权

    公开(公告)号：US20230119129A1

    公开(公告)日：2023-04-20

    申请号：US17967532

    申请日：2022-10-17

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Youngsun LEE ,  Sungwon PARK ,  Eunseok HONG

    IPC: H05K1/02 ,  H05K1/11 ,  H05K1/14

    Abstract: A printed circuit board is provided. The printed circuit board includes: an extending region extending along one direction, and a bending region configured to bend with respect to the extending region. The extending region and the bending region includes a non-conductive layer, a first conductive layer disposed on one surface of the non-conductive layer, a second conductive layer disposed on the other surface of the non-conductive layer, and at least one via hole penetrating the non-conductive layer, the first conductive layer, and the second conductive layer. In the bending region, a cross-sectional area of the via hole in contact with the first conductive layer is less than a cross-sectional area of the via hole in contact with the second conductive layer.

    FLEXIBLE CIRCUIT BOARD AND ELECTRONIC DEVICE COMPRISING SAME
    7.
    发明公开
    FLEXIBLE CIRCUIT BOARD AND ELECTRONIC DEVICE COMPRISING SAME 审中-公开

    公开(公告)号：US20230354511A1

    公开(公告)日：2023-11-02

    申请号：US18348622

    申请日：2023-07-07

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Youngsun LEE ,  Kideok KIM ,  Byeongkeol KIM ,  Jongbum LEE ,  Jongmin JEON ,  Jeongbeom CHO

    IPC: H05K1/02 ,  H05K1/14 ,  H05K3/28

    CPC classification number: H05K1/0281 ,  H05K1/147 ,  H05K3/28 ,  H05K2201/10378

    Abstract: An electronic device is provided. The electronic device includes a housing, a main circuit board arranged inside the housing, and at least one flexible circuit board electrically connected to the main circuit board, wherein the flexible circuit board includes a flexible circuit part, and a joining part arranged on one end of the flexible circuit part and connected to the main circuit board. A first joining part includes a first layer oriented a first direction and having at least one first connection hole, a second layer oriented in a second direction opposite to the first direction and has at least one second connection hole, and a reinforcement member which is arranged between the first and the second layer and is connected to the flexible circuit part while being arranged such that at least a portion thereof overlaps with the one end part of the flexible circuit part.

    PRINTED CIRCUIT BOARD FOR TRANSMITTING SIGNAL IN HIGH-FREQUENCY BAND AND ELECTRONIC DEVICE INCLUDING SAME
    10.
    发明申请
    PRINTED CIRCUIT BOARD FOR TRANSMITTING SIGNAL IN HIGH-FREQUENCY BAND AND ELECTRONIC DEVICE INCLUDING SAME 有权

    公开(公告)号：US20220322522A1

    公开(公告)日：2022-10-06

    申请号：US17298810

    申请日：2021-05-17

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Youngsun LEE ,  Eunseok HONG ,  Byeongkeol KIM ,  Jongmin JEON

    IPC: H05K1/02 ,  H05K1/03

    Abstract: Various embodiments of the disclosure relate to a printed circuit for transmitting a signal in a high-frequency band and an electronic device including the same. The printed circuit board may include a flexible circuit board configured to transmit a signal in a high-frequency band, and the flexible circuit board may include: first multiple layers including a power line configured to transmit power; and second multiple layers stacked in a first direction of the first multiple layers and including a first signal line and a second signal line configured to transmit a signal in the high-frequency band. The first multiple layers may include a first punched region in which at least a portion overlapping the first signal line and the second signal line is removed, the second multiple layers may include a second punched region in which at least a portion overlapping the power line is removed, and at least a portion of the second punched region and the first punched region overlap each other forming a slit penetrating the flexible circuit board in the first direction.

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