ELECTRONIC DEVICE FOR PROVIDING PLAN, AND METHOD OF OPERATING THE SAME

    公开(公告)号:US20220319666A1

    公开(公告)日:2022-10-06

    申请号:US17599887

    申请日:2021-04-13

    Abstract: A method, performed by an electronic device, of providing a plan, is provided. The method includes obtaining a plan including a plurality of items, predicting, for one or more points of time, a storage amount of a first ingredient to be consumed over time based on the plan, measuring the storage amount of the first ingredient at the one or more points of time, detecting a difference between the measured and predicted values at a first point of time from among the one or more points of time, and providing the plan by modifying the plan to reduce the difference after the first point of time, when the detected difference is greater than or equal to a reference value.

    SEMICONDUCTOR PACKAGE INCLUDING UNDERFILL MATERIAL LAYER AND METHOD OF FORMING THE SAME

    公开(公告)号:US20210151410A1

    公开(公告)日:2021-05-20

    申请号:US17036508

    申请日:2020-09-29

    Abstract: A semiconductor package and a method of forming the same are provided. The semiconductor package includes one or a plurality of chips on a substrate, bumps disposed below each of the one or plurality of chips, an underfill material layer on the substrate, on a side surface of each of the bumps, and extending to side surfaces of the one or plurality of chips, and a mold layer on the substrate and contacting the underfill material layer. The underfill material layer includes a first side portion, a second side portion on the first side portion and having a slope, steeper than a slope of the first side portion, and a third side portion on the second side portion and having a slope that is less steep than a slope of the second side portion.

    SEMICONDUCTOR PACKAGE HAVING STACKED SEMICONDUCTOR CHIPS

    公开(公告)号:US20210028152A1

    公开(公告)日:2021-01-28

    申请号:US16833761

    申请日:2020-03-30

    Abstract: Provided is a semiconductor package including a semiconductor stack including a first lower chip, a second lower chip, a gap filler disposed between the first lower chip and the second lower chip, and a first upper chip disposed on an upper surface of the first lower chip, an upper surface of the second lower chip, and an upper surface of the gap filler, the first lower chip includes first upper surface pads and a first upper surface dielectric layer, the second lower chip includes second upper surface pads and a second upper surface dielectric layer, the first upper chip includes lower surface pads and a lower surface dielectric layer, and an area of an upper surface of each of the second upper surface pads is greater than an area of a lower surface of each of the lower surface pads.

    DISPLAY APPARATUS
    6.
    发明申请

    公开(公告)号:US20250022867A1

    公开(公告)日:2025-01-16

    申请号:US18677353

    申请日:2024-05-29

    Abstract: A display apparatus includes a circuit board including driving circuits; and a pixel array on the circuit board and including a plurality of pixels, wherein the pixel array includes LED cells having a pillar shape and including first and second conductivity-type semiconductor layers and an active layer, wherein a width thereof is 100 μm or less, and a height thereof is greater than the width; a transparent electrode on lower surfaces of the LED cells and including a cone or pyramid-shaped inclined portion; a passivation layer disposed on side surfaces of the LED cells and extending from a side surface of the LED cell to a side surface of the inclined portion of the transparent electrode.

    ELECTRONIC DEVICE AND CONTROL METHOD THEREFOR

    公开(公告)号:US20240272596A1

    公开(公告)日:2024-08-15

    申请号:US18643635

    申请日:2024-04-23

    CPC classification number: G05B15/02 H04N21/44204

    Abstract: An electronic apparatus includes: at least one processor, comprising processing circuitry, individually and/or collectively, configured to: acquire usage behavior data about a plurality of applications executed in a plurality of external devices and a plurality of functions provided by each external device, from the plurality of external devices through a communication circuit; acquire relevant information indicating one or more functions performed within a period range based on an execution point in time of the application among the plurality of functions, based on the acquired usage behavior data; and perform a recommended operation of the one or more functions corresponding to an application executed in the external device, based on the acquired relevant information.

    COOKING APPLIANCE
    10.
    发明申请

    公开(公告)号:US20230086024A1

    公开(公告)日:2023-03-23

    申请号:US17993477

    申请日:2022-11-23

    Abstract: A cooking appliance includes a cooking chamber, a shelf disposed in the cooking chamber and comprising a plurality of cooking areas, a plurality of heaters mounted at one portion of the cooking chamber, spaced apart from one another to correspond to the plurality of cooking areas, respectively, and independently controlled to generate heat, and a heat-reflecting plate comprising a plurality of reflectors respectively accommodating the corresponding plurality of heaters therein, and to reflect the heat generated by the plurality of heaters to the corresponding plurality of cooking areas to generate a temperature difference among the plurality of cooking areas.

Patent Agency Ranking