公开(公告)号：US20230211946A1

公开(公告)日：2023-07-06

申请号：US18064248

申请日：2022-12-09

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Youngon OH ,  Jihun KIM ,  Sanghyuk PARK

IPC: B65G1/04

CPC classification number: B65G1/0407

Abstract: A stocker system includes a main frame, a plurality of shelves disposed within the main frame, and a crane adjacent to the main frame. The crane includes a lower module that includes a plurality of lower profiles. An upper module is disposed on the lower module. The upper module includes a plurality of upper profiles and at least one upper expandable plate. The plurality of upper profiles is disposed on the plurality of lower profiles. The at least one upper expandable plate is disposed between the plurality of upper profiles.

公开(公告)号：US20230230864A1

公开(公告)日：2023-07-20

申请号：US17894371

申请日：2022-08-24

Applicant: Samsung Electronics Co., Ltd.

Inventor： Youngon OH ,  Youngcheol JANG ,  Jihun KIM ,  Sanghyuk PARK ,  Sangho YOON ,  SeungYeob LEE ,  Chul Min LEE ,  Hochan LEE ,  Jaegyun JEON ,  Jeongkwan JUNG ,  Hyeong Seok CHOO ,  Dongyeol HAN

IPC: H01L21/677

CPC classification number: H01L21/67733 ,  H01L21/67706 ,  H01L21/67724

Abstract: A semiconductor fabrication facility including raceways on a ceiling of a structural construction and extending in one direction, a vehicle rail assembly coupled to the raceways, outer jig rails on outer sidewalls of the raceways and adjacent to the vehicle rail assembly, and an outer jig on the outer jig rails and configured to allow the vehicle rail assembly to move along the outer jig rails may be provided.

公开(公告)号：US20240383012A1

公开(公告)日：2024-11-21

申请号：US18384633

申请日：2023-10-27

Applicant: Samsung Electronics Co., Ltd.

Inventor： Youngon OH ,  Jihun Kim ,  Sanghyuk Park

IPC: B08B3/02 ,  H01L21/67

Abstract: Disclosed are cleaning apparatuses, semiconductor fabrication systems, and semiconductor fabrication methods. The cleaning apparatus comprises a housing that provides an inner space and a cleaning unit combined with the housing. The housing includes a slit that is upwardly recessed from a bottom surface of the housing and is connected to the inner space and a plurality of placement holes that upwardly extend from the bottom surface of the housing. The cleaning unit includes an intake device in the inner space and an intake pipe one end of which is connected to the intake device and another end of which is connected to the slit.

公开(公告)号：US20240297060A1

公开(公告)日：2024-09-05

申请号：US18531025

申请日：2023-12-06

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Youngon OH ,  Jihun KIM ,  Sanghyuk PARK

IPC: H01L21/677 ,  B65G1/04

CPC classification number: H01L21/67769 ,  B65G1/0464 ,  H01L21/6773 ,  H01L21/67733 ,  H01L21/67775

Abstract: In some embodiments, a storage apparatus for a plurality of semiconductor devices includes a plurality of frames stacked at least partially on top of one another in a vertical direction, a plurality of shelves provided to be slidably movable on the plurality of frames along at least one guide rail extending in a first horizontal direction, a coupling portion including first couplers and second couplers that are selectively engaged with each other by an external control signal, and a driving portion provided to be movable in the first horizontal direction along the at least one guide rail. The plurality of shelves are configured to accommodate the plurality of semiconductor devices on upper surfaces of the plurality of shelves. The first couplers are provided on a first side surface of the plurality of shelves, and the second couplers are provided on a second opposite side surface of the plurality of shelves.