公开(公告)号：US20230067970A1

公开(公告)日：2023-03-02

申请号：US17891273

申请日：2022-08-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hoejoo LEE ,  Youngcheol JANG

IPC: G06N5/02 ,  H04W24/02

Abstract: According to various embodiments, a method of operating an electronic device may include: storing at least one value corresponding to each of at least one parameter associated with a radio access network (RAN), and information associated with an operation performed by the RAN. A value corresponding to at least some parameters among the at least one parameter may be used when at least one operation determination model executed by the electronic device determines at least a part of the information associated with the operation. The method of the electronic device may further include: identifying a request for experience information for learning a first operation determination model from a first learning learner for learning the first operation determination model among the at least one operation determination model, identifying, from the at least one value, a value corresponding to at least one first parameter corresponding to the first operation determination model and information associated with an operation corresponding to the at least one first parameter, in response to the request, and providing at least some among the value corresponding to the at least one first parameter, the information associated with the operation corresponding to the at least one first parameter, and a reward value identified based on at least a part of the value corresponding to the at least one first parameter, to the first learning learner as the experience information.

公开(公告)号：US20230230864A1

公开(公告)日：2023-07-20

申请号：US17894371

申请日：2022-08-24

Applicant: Samsung Electronics Co., Ltd.

Inventor： Youngon OH ,  Youngcheol JANG ,  Jihun KIM ,  Sanghyuk PARK ,  Sangho YOON ,  SeungYeob LEE ,  Chul Min LEE ,  Hochan LEE ,  Jaegyun JEON ,  Jeongkwan JUNG ,  Hyeong Seok CHOO ,  Dongyeol HAN

IPC: H01L21/677

CPC classification number: H01L21/67733 ,  H01L21/67706 ,  H01L21/67724

Abstract: A semiconductor fabrication facility including raceways on a ceiling of a structural construction and extending in one direction, a vehicle rail assembly coupled to the raceways, outer jig rails on outer sidewalls of the raceways and adjacent to the vehicle rail assembly, and an outer jig on the outer jig rails and configured to allow the vehicle rail assembly to move along the outer jig rails may be provided.