公开(公告)号：US20220386487A1

公开(公告)日：2022-12-01

申请号：US17885027

申请日：2022-08-10

Applicant: Samsung Electronics Co., Ltd.

Inventor： Minsoo LEE ,  Younghun SEONG ,  Jaehoon LEE ,  Wanjae JU

IPC: H05K5/02 ,  G06F1/16 ,  H05K5/00 ,  H04M1/02

Abstract: A foldable electronic device is provided. The foldable electronic device includes a foldable housing including a first housing portion, a second housing portion, and a hinge structure connected with the first housing portion and the second housing portion, the foldable housing configured to be folded about a folding axis; a flexible display accommodated in the first housing portion and the second housing portion; a plurality of rigid printed circuit boards (RPCBs) including a first RPCB accommodated in the first housing portion and a second RPCB accommodated in the second housing portion; a first flexible printed circuit board (FPCB) configured to electronically connect with the first RPCB and the second RPCB, the first FPCB including a first flexible portion located through a designated area of the hinge structure, the first FPCB including a first rigid portion and a second rigid portion affixed to a part of the hinge structure; a second FPCB configured to electronically connect with the first RPCB and the second RPCB, the second FPCB including a second flexible portion located through the designated area of the hinge structure, the second FPCB including a third rigid portion and a fourth rigid portion affixed to a part of the hinge structure, wherein the second flexible portion of the second FPCB is spaced apart and substantially parallel from the first flexible portion of the first FPCB; and a bending-guide member attached to the first FPCB between the first rigid portion and the second rigid portion, and attached to the second FPCB between the third rigid portion and the fourth rigid portion such that the first flexible portion and the second flexible portion are held together.

公开(公告)号：US20210247806A1

公开(公告)日：2021-08-12

申请号：US17172743

申请日：2021-02-10

Applicant: Samsung Electronics Co., Ltd.

Inventor： Minsoo LEE ,  Younghun SEONG ,  Jaehoon LEE ,  Wanjae JU

IPC: G06F1/16

Abstract: A foldable electronic device is provided. The foldable electronic device includes a hinge structure, a foldable housing, a flexible display disposed inside the foldable housing, a first flexible connection member, a second flexible connection member, an adhesive member attached to the first flexible connection member. The foldable housing includes a first housing structure and a second housing structure. The first housing structure includes a first surface, a second surface, and a first printed circuit board. The second housing structure includes a third surface, a fourth surface, and a second printed circuit board.

公开(公告)号：US20230413443A1

公开(公告)日：2023-12-21

申请号：US18230444

申请日：2023-08-04

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Younghun SEONG ,  Bumhee BAE ,  Euisung KANG ,  Hyeonhak KIM ,  Kanghyun RYOO ,  Jaehoon LEE

IPC: H05K1/14 ,  G06F1/16 ,  H05K1/11 ,  H05K1/02

CPC classification number: H05K1/147 ,  H05K1/028 ,  H05K1/118 ,  G06F1/1652

Abstract: An electronic device can include a hinge structure; a flexible display which is folded or unfolded by the hinge structure; a first portion and a second portion which are close to and facing each other when folded by the hinge structure, and spaced apart when unfolded; a first circuit board disposed on the first portion; a second circuit board disposed on the second portion; and a flexible circuit board electrically connecting the first printed circuit board and the second circuit board. The flexible printed circuit board includes a first area which bends in response to the deformation of the electronic device, and a second region positioned around the first region that does not bend. The first region may include a single main signal wiring layer. The second portion may include a plurality of signal wiring layers. The first region and the second region may be formed to have different thicknesses.

公开(公告)号：US20240073307A1

公开(公告)日：2024-02-29

申请号：US18387351

申请日：2023-11-06

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Bumhee BAE ,  Kiman KIM ,  Junggil KIM ,  Younghun SEONG ,  Jeongnam CHEON

IPC: H04M1/02 ,  H05K1/02 ,  H05K1/18

CPC classification number: H04M1/0277 ,  H04M1/0216 ,  H04M1/0274 ,  H05K1/0253 ,  H05K1/189

Abstract: A flexible circuit board and a foldable electronic device includes a first multi-layer region, a second multi-layer region and a highly bendable region disposed between the first multi-layer region and the second multi-layer region. The first multi-layer region and the second multi-layer region include a structure in which a plurality of copper clad laminates (CCLs) are stacked. The highly bendable region includes a structure in which a single CCL extending from one CCL among the plurality of CCLs in the first multi-layer region and the second multi-layer region is stacked. The single CCL may be configured such that a first ground wire, a second ground wire, and a plurality of sub wires disposed to be spaced apart between the first ground wire and the second ground wire transmit a single RF signal.

公开(公告)号：US20230171881A1

公开(公告)日：2023-06-01

申请号：US18096844

申请日：2023-01-13

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Bumhee BAE ,  Younghun SEONG ,  Jaehoon LEE ,  Jeongnam CHEON

IPC: H05K1/02 ,  H05K1/18

CPC classification number: H05K1/028 ,  H05K1/0272 ,  H05K1/181 ,  H05K2201/09063 ,  H05K2201/093 ,  H05K2201/10128 ,  H05K2201/10098 ,  G06F1/1652

Abstract: A flexible printed circuit board (FPCB) assembly includes an electrically conductive layer configured to transmit a signal, a dielectric layer provided on the electrically conductive layer, a ground layer provided on the dielectric layer, and an auxiliary metal layer provided on or under the ground layer, and connecting a plurality of regions of the ground layer to each other, where the electrically conductive layer, the dielectric layer, the ground layer, and the auxiliary metal layer are flexible.

公开(公告)号：US20230040596A1

公开(公告)日：2023-02-09

申请号：US17879303

申请日：2022-08-02

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sungwon PARK ,  Sunyoung KIM ,  Younghun SEONG ,  Yongjin SHIN

IPC: H05K1/02 ,  G06F1/16 ,  H01B7/08 ,  H01Q1/38

Abstract: An electronic device is provided. The electronic device includes a housing, and a flexible connecting member disposed inside the housing, the flexible connecting member including a dielectric substrate, at least one signal wire disposed on one surface of the dielectric substrate, and at least one ground disposed on the other surface of the dielectric substrate adjacent to the signal wire. The at least one signal wire and the at least one ground may be disposed to be spaced apart from each other when viewed from above the dielectric substrate. A flexible connecting member may include a dielectric substrate, a signal wire disposed on one surface of the dielectric substrate, and a ground disposed on the other surface of the dielectric substrate adjacent to the signal wire. The signal wire and the ground may be disposed to be spaced apart from each other when viewed from above the dielectric substrate.