公开(公告)号：US20230413443A1

公开(公告)日：2023-12-21

申请号：US18230444

申请日：2023-08-04

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Younghun SEONG ,  Bumhee BAE ,  Euisung KANG ,  Hyeonhak KIM ,  Kanghyun RYOO ,  Jaehoon LEE

IPC: H05K1/14 ,  G06F1/16 ,  H05K1/11 ,  H05K1/02

CPC classification number: H05K1/147 ,  H05K1/028 ,  H05K1/118 ,  G06F1/1652

Abstract: An electronic device can include a hinge structure; a flexible display which is folded or unfolded by the hinge structure; a first portion and a second portion which are close to and facing each other when folded by the hinge structure, and spaced apart when unfolded; a first circuit board disposed on the first portion; a second circuit board disposed on the second portion; and a flexible circuit board electrically connecting the first printed circuit board and the second circuit board. The flexible printed circuit board includes a first area which bends in response to the deformation of the electronic device, and a second region positioned around the first region that does not bend. The first region may include a single main signal wiring layer. The second portion may include a plurality of signal wiring layers. The first region and the second region may be formed to have different thicknesses.