公开(公告)号：US20240079288A1

公开(公告)日：2024-03-07

申请号：US18506742

申请日：2023-11-10

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Youngho KIM ,  Hwanpil PARK

IPC: H01L23/367 ,  H01L23/00 ,  H01L23/373 ,  H01L23/40 ,  H01L23/492 ,  H01L25/10

CPC classification number: H01L23/367 ,  H01L23/3677 ,  H01L23/3736 ,  H01L23/3738 ,  H01L23/40 ,  H01L23/492 ,  H01L24/19 ,  H01L25/105 ,  H01L23/49816

Abstract: A method of fabricating a semiconductor package structure is provided. The structure is configured to include a base substrate, a die placed on the base substrate, the die including a semiconductor device, a solder bump placed on one surface of the die to exhaust heat generated in the die to an outside; and a solder ball placed on other surface of the die facing the one surface to transmit a signal, which is produced by the semiconductor device of the die, to an external device.

公开(公告)号：US20180240729A1

公开(公告)日：2018-08-23

申请号：US15754520

申请日：2016-08-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Youngho KIM ,  Hwanpil PARK

IPC: H01L23/367 ,  H01L23/373 ,  H01L23/40 ,  H01L23/492 ,  H01L23/00

CPC classification number: H01L23/367 ,  H01L23/3677 ,  H01L23/3736 ,  H01L23/3738 ,  H01L23/40 ,  H01L23/492 ,  H01L23/49816 ,  H01L23/5389 ,  H01L24/19 ,  H01L25/105 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16225 ,  H01L2224/19 ,  H01L2224/73259 ,  H01L2924/15153

Abstract: A method of fabricating a semiconductor package structure is provided. The structure is configured to include a base substrate, a die disposed on the base substrate, the die including a semiconductor device, a solder bump disposed on a surface of the die, and configured to discharge heat generated in the die to an outside; and a solder ball disposed on another surface, opposite to the surface, of the die, and configured to transmit a signal, which is produced by the semiconductor device of the die, to an external device.

公开(公告)号：US20210082783A1

公开(公告)日：2021-03-18

申请号：US17078422

申请日：2020-10-23

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Youngho KIM ,  Hwanpil PARK

IPC: H01L23/367 ,  H01L23/373 ,  H01L23/40 ,  H01L23/00 ,  H01L23/492 ,  H01L25/10

Abstract: A method of fabricating a semiconductor package structure is provided. The structure is configured to include a base substrate, a die placed on the base substrate, the die including a semiconductor device, a solder bump placed on one surface of the die to exhaust heat generated in the die to an outside; and a solder ball placed on other surface of the die facing the one surface to transmit a signal, which is produced by the semiconductor device of the die, to an external device.

公开(公告)号：US20160196030A1

公开(公告)日：2016-07-07

申请号：US14989298

申请日：2016-01-06

Applicant: Samsung Electronics Co., Ltd.

Inventor： Youngho KIM

IPC: G06F3/0488 ,  G06F17/22 ,  G06F3/0481 ,  G06F3/0485

CPC classification number: G06F3/0488 ,  G06F1/1694 ,  G06F3/04817 ,  G06F3/0485 ,  G06F3/04883 ,  G06F17/2247 ,  G06F2200/1637

Abstract: A method for displaying an electronic document by an electronic device is provided. The method includes moving the electronic document in a display of the electronic document according to a user input, outputting an alert and temporarily stopping the moving of the electronic document when at least one edge of the electronic document reaches at least one boundary of the display, and displaying the electronic document having the at least one edge of the electronic document spaced apart from the at least one boundary of the display when an additional user input is received.

Abstract translation: 提供了一种通过电子设备显示电子文档的方法。 该方法包括：当电子文档的至少一个边缘到达显示器的至少一个边界时，根据用户输入将电子文档移动到电子文档的显示器中，输出警报并暂时停止电子文档的移动， 以及当接收到附加用户输入时，显示具有与所述显示器的所述至少一个边界间隔开的所述电子文档的所述至少一个边缘的所述电子文档。

公开(公告)号：US20150169167A1

公开(公告)日：2015-06-18

申请号：US14568288

申请日：2014-12-12

Applicant: Samsung Electronics Co., Ltd.

Inventor： Youngho KIM ,  Hoshin LEE ,  Sangtae JI

IPC: G06F3/0488 ,  G06F3/0485

CPC classification number: G06F3/0488 ,  G06F3/0481 ,  G06F3/0485 ,  G06F2203/04806 ,  G06F2203/04808

Abstract: An electronic device and method for the same are disclosed, including a touch device for detecting a touch input, a display unit for displaying screen information, a storage unit for storing a predetermined number of individual contacts to the touch device, and a controller. The controller compares a number of individual contacts with the predetermined number of individual contacts in response to detecting a touch input via the touch device, executes a scrolling of the displayed screen information according to a movement of the touch input when the number of individual contacts of the touch input matches the predetermined number, and when the number of individual contacts of the touch input does not match the predetermined number, executes a gesture-based zoom according to a change in area defined by the individual contacts of the touch input.

Abstract translation: 公开了一种电子装置及其方法，包括用于检测触摸输入的触摸装置，用于显示屏幕信息的显示单元，用于存储预定数量的单独触点到触摸装置的存储单元和控制器。 响应于检测到经由触摸设备的触摸输入，控制器将多个单独的触点与预定数量的各个触点进行比较，当根据触摸输入的个数接触的数量时，根据触摸输入的移动来执行所显示的屏幕信息的滚动 触摸输入与预定数量匹配，并且当触摸输入的各个联系人的数量与预定数量不匹配时，根据由触摸输入的各个联系人定义的区域的变化来执行基于手势的缩放。

公开(公告)号：US20250003812A1

公开(公告)日：2025-01-02

申请号：US18810429

申请日：2024-08-20

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jaebum LEE ,  Hyunggwang KANG ,  Youngho KIM ,  Junho LEE ,  Seokmin JANG ,  Hyunju HONG

IPC: G01K13/06 ,  G01K7/22

Abstract: An electronic device according to various embodiments of the disclosure may include a first housing, a second housing configured to be slid into the first housing and slid out from the first housing, a substrate part disposed between the front surface and the rear surface in the first housing and including at least one heat source, a first temperature sensor disposed on the substrate part, a second temperature sensor disposed in the second housing, and at least one processor. The at least one processor is configured to calculate a temperature of the electronic device based on at least one of a measurement value of the first temperature sensor or a measurement value of the second temperature sensor. Various other embodiments may be possible.

公开(公告)号：US20220216121A1

公开(公告)日：2022-07-07

申请号：US17700956

申请日：2022-03-22

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Youngho KIM ,  Hwanpil Park

IPC: H01L23/367 ,  H01L23/373 ,  H01L23/40 ,  H01L23/00 ,  H01L23/492 ,  H01L25/10

Abstract: A method of fabricating a semiconductor package structure is provided. The structure is configured to include a base substrate, a die placed on the base substrate, the die including a semiconductor device, a solder bump placed on one surface of the die to exhaust heat generated in the die to an outside; and a solder ball placed on other surface of the die facing the one surface to transmit a signal, which is produced by the semiconductor device of the die, to an external device.