公开(公告)号：US20180040737A1

公开(公告)日：2018-02-08

申请号：US15423035

申请日：2017-02-02

Applicant: Samsung Electronics Co., Ltd. ,  Research & Business Foundation Sungkyunkwan University

Inventor： Seunggeol NAM ,  Wonjong YOO ,  Zheng YANG

IPC: H01L29/786 ,  H01L29/66 ,  H01L29/24

CPC classification number: H01L29/78618 ,  H01L29/24 ,  H01L29/45 ,  H01L29/66969 ,  H01L29/778 ,  H01L29/78681 ,  H01L29/78696 ,  H01L29/861

Abstract: Provided are electronic devices having a two-dimensional (2D) material layer. The electronic device includes an electrode layer that directly contacts an edge of the 2D material layer. The electrode layer may include a conductive material having a high work function or may have a structure in which an electrode layer includes a conductive material having a high work function and an electrode layer includes a conductive material having a low work function.

公开(公告)号：US20150340522A1

公开(公告)日：2015-11-26

申请号：US14554363

申请日：2014-11-26

Applicant: Samsung Electronics Co., Ltd.

Inventor： Minsup CHOI ,  Wonjong YOO ,  Deshun QU ,  Changho RA ,  Xiaochi LIU ,  Seunghwan LEE ,  Jia LEE

IPC: H01L31/0224 ,  H01L31/0232 ,  H01L31/0216 ,  H01L31/18

CPC classification number: H01L31/18 ,  H01L31/022425 ,  H01L31/032 ,  H01L31/054 ,  Y02E10/52

Abstract: According to example embodiments, an electronic device includes a substrate, an insulating layer on the substrate, and a diode layer on the insulating layer. The diode layer includes a two dimensional (2D) material layer. The 2D material layer includes an N-type region and a P-type region. According to example embodiments, a method of manufacturing an electronic device includes forming an insulating film on a substrate, forming a 2D material layer on the insulating film, and dividing the 2D material layer into an N-type region and a P-type region.

Abstract translation: 根据示例性实施例，电子设备包括衬底，衬底上的绝缘层和绝缘层上的二极管层。 二极管层包括二维（2D）材料层。 2D材料层包括N型区域和P型区域。 根据示例性实施例，一种制造电子器件的方法包括在衬底上形成绝缘膜，在绝缘膜上形成2D材料层，并将2D材料层划分成N型区域和P型区域。

公开(公告)号：US20160300958A1

公开(公告)日：2016-10-13

申请号：US15054871

申请日：2016-02-26

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seongjun PARK ,  Jaeho LEE ,  Changho RA ,  Wonjong YOO ,  Faisal AHMED ,  Zheng YANG ,  Xiaochi LIU

IPC: H01L29/786 ,  H01L29/66 ,  H01L21/467 ,  H01L29/24 ,  H01L21/02

CPC classification number: H01L29/78681 ,  H01L29/04 ,  H01L29/045 ,  H01L29/0665 ,  H01L29/1606 ,  H01L29/24 ,  H01L29/66969 ,  H01L29/778 ,  H01L29/78687 ,  H01L29/78696

Abstract: An electronic device includes a 2D material layer having a bandgap. The 2D material layer includes two multilayer 2D material regions and a channel region therebetween. A first electrode electrically contacts one of the multilayer 2D material regions, and a second electrode electrically contacts the other of the multilayer 2D material regions.

Abstract translation: 电子设备包括具有带隙的2D材料层。 2D材料层包括两个多层2D材料区域和它们之间的沟道区域。 第一电极电接触所述多层2D材料区域中的一个，并且第二电极与所述多层2D材料区域中的另一个电接触。