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公开(公告)号:US20210384213A1
公开(公告)日:2021-12-09
申请号:US17408819
申请日:2021-08-23
Applicant: Samsung Electronics Co., Ltd.
Inventor: Jong-kook PARK , Hong-soo KIM , Tae-keun CHO
IPC: H01L27/11556 , H01L27/11521 , H01L27/11526 , H01L27/11568 , H01L27/11573 , H01L27/11582
Abstract: A semiconductor memory device includes: a substrate including a cell region and a connection region; a first word line stack comprising a plurality of first word lines that extend to the connection region and are stacked on the cell region,; a second word line stack comprising a plurality of second word lines that extend to the connection region and are stacked on the cell region, the second word line being adjacent to the first word line stack; vertical channels in the cell region of the substrate, the vertical channels being connected to the substrate and coupled with the plurality of first and second word lines; a bridge region that connects the first word lines of the first word line stack with the second word lines of the second word line stack; and a local planarized region under the bridge region.
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公开(公告)号:US20240284665A1
公开(公告)日:2024-08-22
申请号:US18640451
申请日:2024-04-19
Applicant: Samsung Electronics Co., Ltd.
Inventor: Jong-kook PARK , Hong-soo KIM , Tae-keun CHO
Abstract: A semiconductor memory device includes: a substrate including a cell region and a connection region; a first word line stack comprising a plurality of first word lines that extend to the connection region and are stacked on the cell region; a second word line stack comprising a plurality of second word lines that extend to the connection region and are stacked on the cell region, the second word line being adjacent to the first word line stack; vertical channels in the cell region of the substrate, the vertical channels being connected to the substrate and coupled with the plurality of first and second word lines; a bridge region that connects the first word lines of the first word line stack with the second word lines of the second word line stack; and a local planarized region under the bridge region.
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