SEMICONDUCTOR MEMORY DEVICE AND SEMICONDUCTOR DEVICE

    公开(公告)号:US20210384213A1

    公开(公告)日:2021-12-09

    申请号:US17408819

    申请日:2021-08-23

    Abstract: A semiconductor memory device includes: a substrate including a cell region and a connection region; a first word line stack comprising a plurality of first word lines that extend to the connection region and are stacked on the cell region,; a second word line stack comprising a plurality of second word lines that extend to the connection region and are stacked on the cell region, the second word line being adjacent to the first word line stack; vertical channels in the cell region of the substrate, the vertical channels being connected to the substrate and coupled with the plurality of first and second word lines; a bridge region that connects the first word lines of the first word line stack with the second word lines of the second word line stack; and a local planarized region under the bridge region.

    SEMICONDUCTOR MEMORY DEVICE AND SEMICONDUCTOR DEVICE

    公开(公告)号:US20240284665A1

    公开(公告)日:2024-08-22

    申请号:US18640451

    申请日:2024-04-19

    Abstract: A semiconductor memory device includes: a substrate including a cell region and a connection region; a first word line stack comprising a plurality of first word lines that extend to the connection region and are stacked on the cell region; a second word line stack comprising a plurality of second word lines that extend to the connection region and are stacked on the cell region, the second word line being adjacent to the first word line stack; vertical channels in the cell region of the substrate, the vertical channels being connected to the substrate and coupled with the plurality of first and second word lines; a bridge region that connects the first word lines of the first word line stack with the second word lines of the second word line stack; and a local planarized region under the bridge region.

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