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公开(公告)号:US20230317418A1
公开(公告)日:2023-10-05
申请号:US18068778
申请日:2022-12-20
Applicant: Samsung Electronics Co., Ltd.
Inventor: Jungmin KO , Sangki NAM , Dougyong SUNG , Byeongsang KIM , Yunhwan KIM , Suyoung YOO , Namkyun KIM , Kuihyun YOON
IPC: H01J37/32
CPC classification number: H01J37/3244 , H01J37/32568 , H01J2237/3343 , H01J2237/2001
Abstract: A substrate processing apparatus includes a process chamber having an internal space; upper and lower electrode portions facing each other in the internal space; and a gas supply unit configured to supply cooling gas to a bottom surface of a substrate seated on the lower electrode portion. The gas supply unit may include a gas supply source outside the process chamber and configured to provide a cooling gas, and a gas filter connected to the gas supply source and including one or more wall surfaces at least partially defining a gas flow path for the cooling gas. The gas filter may include a first and second regions formed of respective materials having different dielectric constants. The first and second regions may be configured so that the cooling gas flowing along the gas flow path flows upwardly concurrently with colliding with a wall surface of the gas flow path.
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公开(公告)号:US20240192604A1
公开(公告)日:2024-06-13
申请号:US18216028
申请日:2023-06-29
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Jaehong LIM , Youngho HWANG , Byungjo KIM , Sangki NAM , Suyoung YOO , Sanghyun LIM , Youngkyun IM , Hyungkyu CHOI , Seok HEO
IPC: G03F7/40
CPC classification number: G03F7/40
Abstract: A post baking apparatus comprising a baking chamber configured to receive a substrate with an exposed photoresist film, a lower heater in the baking chamber under the substrate to heat the exposed photoresist film, an applier applying an electric field or a magnetic field to the exposed photoresist film along a vertical direction, which is substantially perpendicular to an upper surface of the exposed photoresist film, to control diffusions of an acid or a secondary electron, which are generated from the exposed photoresist film, along a horizontal direction, and a controller configured to control an operation of the applier.
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