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公开(公告)号:US10134583B2
公开(公告)日:2018-11-20
申请号:US15349359
申请日:2016-11-11
Applicant: Samsung Electronics Co., Ltd.
Inventor: Sunhye Hwang , Myong Woon Kim , Younjoung Cho , Sang Ick Lee , Sang Yong Jeon , In Kyung Jung , Wonwoong Chung , Jungsik Choi
IPC: H01L21/02 , H01L21/768 , H01L21/31 , H01L23/48 , C23C16/40 , H01L23/532 , C23C16/56 , C01B33/12
Abstract: A method of forming a dielectric layer includes forming a preliminary dielectric layer on a substrate using a silicon precursor and performing an energy treatment on the preliminary dielectric layer to form a dielectric layer. In the dielectric layer, a ratio of Si—CH3 bonding unit to Si—O bonding unit ranges from 0.5 to 5.
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公开(公告)号:US12287064B2
公开(公告)日:2025-04-29
申请号:US17037934
申请日:2020-09-30
Applicant: SK Specialty Co., Ltd. , SAMSUNG ELECTRONICS CO., LTD.
Inventor: Sunhye Hwang , Wonwoong Chung , Younjoung Cho , Youngha Song , Yonghun Shin , Byungkil Lee , Sungdo Lee , Jinhee Lee
IPC: C23C14/24 , C23C16/455 , F17C1/00 , F17C1/14
Abstract: A deposition system and a gas storage device, the deposition system including a process chamber; and a gas supply outside of the process chamber, the gas supply being configured to provide monochlorosilane, wherein the gas supply includes a cabinet; and a gas container inside the cabinet, and the gas container includes aluminum (Al).
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