公开(公告)号：US20230008686A1

公开(公告)日：2023-01-12

申请号：US17561276

申请日：2021-12-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sungil Choi ,  Yeeun Park ,  Kyungbeom Kim ,  Sungyoon Ryu ,  Jinwoo Ahn ,  Sunhong Jun

IPC: G02B21/00 ,  G01J3/28 ,  G02B21/36 ,  G02B21/02

Abstract: An inspection system includes a main support die configured to receive a target specimen; an auxiliary support die adjacent to the main support die and configured to receive a reference specimen; a cleaning device configured to remove contaminants from the reference specimen; an objective lens unit configured to direct light to main support die from a light source adjacent to the objective lens unit; a spectroscope between the objective lens unit and the light source; a detector adjacent to the objective lens unit; an imaging device between the objective lens unit and the detector; and a computer system in communication with the detector.

公开(公告)号：US11921270B2

公开(公告)日：2024-03-05

申请号：US17561276

申请日：2021-12-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sungil Choi ,  Yeeun Park ,  Kyungbeom Kim ,  Sungyoon Ryu ,  Jinwoo Ahn ,  Sunhong Jun

IPC: G02B21/02 ,  G01J3/28 ,  G02B21/00 ,  G02B21/36

CPC classification number: G02B21/0004 ,  G01J3/2823 ,  G02B21/02 ,  G02B21/36

Abstract: An inspection system includes a main support die configured to receive a target specimen; an auxiliary support die adjacent to the main support die and configured to receive a reference specimen; a cleaning device configured to remove contaminants from the reference specimen; an objective lens unit configured to direct light to main support die from a light source adjacent to the objective lens unit; a spectroscope between the objective lens unit and the light source; a detector adjacent to the objective lens unit; an imaging device between the objective lens unit and the detector; and a computer system in communication with the detector.

公开(公告)号：US11658057B2

公开(公告)日：2023-05-23

申请号：US17029402

申请日：2020-09-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sungil Choi ,  Hyeondong Song ,  Myeongshik Shim ,  Jonghyun Hong ,  Bonggyo Seo

IPC: H01L21/683 ,  H01L21/687

CPC classification number: H01L21/6838 ,  H01L21/68735

Abstract: A wafer chuck includes a body portion; a vacuum barrier portion including a wall structure arranged at the same distance from a center point of the body portion; f protrusions arranged inside and outside the vacuum barrier portion, protruding from a top surface of the body portion and spaced apart from each other; and a vacuum portion including vacuum holes spaced apart from each other penetrating the body portion inside the vacuum barrier portion.