公开(公告)号：US11658057B2

公开(公告)日：2023-05-23

申请号：US17029402

申请日：2020-09-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sungil Choi ,  Hyeondong Song ,  Myeongshik Shim ,  Jonghyun Hong ,  Bonggyo Seo

IPC: H01L21/683 ,  H01L21/687

CPC classification number: H01L21/6838 ,  H01L21/68735

Abstract: A wafer chuck includes a body portion; a vacuum barrier portion including a wall structure arranged at the same distance from a center point of the body portion; f protrusions arranged inside and outside the vacuum barrier portion, protruding from a top surface of the body portion and spaced apart from each other; and a vacuum portion including vacuum holes spaced apart from each other penetrating the body portion inside the vacuum barrier portion.

公开(公告)号：USD1063595S1

公开(公告)日：2025-02-25

申请号：US29894971

申请日：2023-06-15

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Designer： Hyungjoo Lee ,  Hyeondong Song

公开(公告)号：USD1062662S1

公开(公告)日：2025-02-18

申请号：US29894919

申请日：2023-06-15

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Designer： Hyungjoo Lee ,  Hyeondong Song