公开(公告)号：US20170005100A1

公开(公告)日：2017-01-05

申请号：US15139444

申请日：2016-04-27

Applicant: Samsung Electronics Co., Ltd.

Inventor： Min Hee CHO ,  Satoru YAMADA ,  Sung-Sam LEE ,  Jung-Bun LEE

IPC: H01L27/108

CPC classification number: H01L27/10897 ,  H01L23/522 ,  H01L23/5226

Abstract: A semiconductor device may include a plurality of dummy wirings formed on a substrate at different vertical levels and electrically floated and a plurality of dummy contact plugs each electrically connected between two adjacent dummy wirings of the plurality of dummy wiring of the plurality of dummy wirings. No dummy wiring of the plurality of dummy wirings is electrically connected to a terminal of any one of a plurality of transistors included in the substrate.

Abstract translation: 半导体器件可以包括形成在不同垂直级别的基板上的电浮置的多个虚拟布线和多个虚拟接触插塞，每个虚拟接触插头电连接在多个虚拟布线中的多个虚拟布线的两个相邻的虚拟布线之间。 多个虚拟布线的虚拟布线不与基板中包含的多个晶体管中的任一个晶体管的端子电连接。