公开(公告)号：US20180366615A1

公开(公告)日：2018-12-20

申请号：US15841937

申请日：2017-12-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： Chi-Goo Kang ,  Sun-Woo KIM ,  Jong-Sup SONG ,  Ho-Young SONG

IPC: H01L33/44 ,  H01L33/48 ,  H01L33/38 ,  H01L23/00

Abstract: A packaged light emitting device can include a mounting substrate including first and second electrode portions that are separated by a recess defined by a first side surface of the first electrode portion and a second side surface of the second electrode portion that is opposite the first side surface. An insulation support member can partially fill a lower portion of the recess to partially cover the first side surface and partially cover the second side surface. A light emitting device can be coupled to the first and second electrode portions of the mounting substrate and a sealing member can be on the mounting substrate covering the light emitting device.