公开(公告)号：US10699991B2

公开(公告)日：2020-06-30

申请号：US15841937

申请日：2017-12-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： Chi-Goo Kang ,  Sun-Woo Kim ,  Jong-Sup Song ,  Ho-Young Song

IPC: H01L23/495 ,  H01L33/44 ,  H01L23/00 ,  H01L33/38 ,  H01L33/48 ,  H01L33/62 ,  H01L23/48

Abstract: A packaged light emitting device can include a mounting substrate including first and second electrode portions that are separated by a recess defined by a first side surface of the first electrode portion and a second side surface of the second electrode portion that is opposite the first side surface. An insulation support member can partially fill a lower portion of the recess to partially cover the first side surface and partially cover the second side surface. A light emitting device can be coupled to the first and second electrode portions of the mounting substrate and a sealing member can be on the mounting substrate covering the light emitting device.

公开(公告)号：US11133443B2

公开(公告)日：2021-09-28

申请号：US16507183

申请日：2019-07-10

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Chi-Goo Kang ,  Young-Kyung Kim ,  Young-Ho Park ,  Jong-Won Park ,  Seog-Ho Lim

IPC: H01L33/50 ,  H01L33/54 ,  H01L33/48 ,  H01L33/64 ,  H01L33/62

Abstract: A light emitting device package includes a mounting substrate including first and second lower electrode portions separated by a first groove, first and second upper electrode portions separated by a second groove connected to the first groove and disposed on the first and second lower electrode portions respectively, and an insulation support member filling the first groove, a light emitting device mounted on the first and second upper electrode portions of the mounting substrate, a double phosphor film covering an upper surface of the light emitting device, including a phosphor layer and a barrier layer sequentially stacked on each other, and having a thickness of 200 μm or less, and a sealing member on the mounting substrate covering the light emitting device and the double phosphor film.

公开(公告)号：US20180366615A1

公开(公告)日：2018-12-20

申请号：US15841937

申请日：2017-12-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： Chi-Goo Kang ,  Sun-Woo KIM ,  Jong-Sup SONG ,  Ho-Young SONG

IPC: H01L33/44 ,  H01L33/48 ,  H01L33/38 ,  H01L23/00

Abstract: A packaged light emitting device can include a mounting substrate including first and second electrode portions that are separated by a recess defined by a first side surface of the first electrode portion and a second side surface of the second electrode portion that is opposite the first side surface. An insulation support member can partially fill a lower portion of the recess to partially cover the first side surface and partially cover the second side surface. A light emitting device can be coupled to the first and second electrode portions of the mounting substrate and a sealing member can be on the mounting substrate covering the light emitting device.