公开(公告)号：US09933862B2

公开(公告)日：2018-04-03

申请号：US14829081

申请日：2015-08-18

Applicant: Samsung Electronics Co., Ltd.

Inventor： Eun-Soo Park ,  Sun-Ho Kim ,  Jung-Ho Kim

IPC: H04N5/232 ,  G06F3/03 ,  G06F1/32 ,  G06F3/00 ,  H04N1/00

CPC classification number: G06F3/0304 ,  G06F1/3231 ,  G06F3/005 ,  H04N1/00 ,  H04N5/232 ,  H04N5/23212 ,  H04N5/23216 ,  H04N5/23241 ,  H04N5/23293 ,  Y02D10/173

Abstract: A method for sensing proximity by an electronic device is provided. The method includes confirming a phase difference regarding a corresponding subject of an image acquired through a lens of the electronic device by operating a phase-difference autofocus sensor and determining that the corresponding subject is proximate to the electronic device when the confirmed phase difference is larger than a designated first reference value.

公开(公告)号：US20200161099A1

公开(公告)日：2020-05-21

申请号：US16444590

申请日：2019-06-18

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jin-Uk Park ,  Sun-Ho Kim ,  Sung-Jin Kim ,  Jong-Geug Kim ,  Kyu-Chul Shim ,  Ji-Hoon Yeo ,  Shin-Sang Lee ,  Gyu-Chan Jeoung ,  Sung-Wook Jung ,  Jae-Chul Hwang

IPC: H01J37/32 ,  H01L21/687

Abstract: An apparatus for attaching a pad on or to an edge ring includes a chamber defining a space for attaching a pad on or to an edge ring, a pad support within the chamber and supporting the pad thereon, an edge ring support within the chamber and facing the pad support, the edge ring support securing the edge ring thereon, a driving system connected to at least one of the pad support and the edge ring support and configured to move the edge ring support relative to the pad support, and a vacuum exhaust system configured to create a vacuum atmosphere within the chamber.

公开(公告)号：US09889556B2

公开(公告)日：2018-02-13

申请号：US14661688

申请日：2015-03-18

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sun-Ho Kim ,  Ki-Hoon Nam ,  Tae-Min Earmme ,  Seok Heo ,  Jae-Chul Hwang

IPC: A01B1/00 ,  B25J9/04 ,  B25J9/10 ,  H01L21/677

CPC classification number: B25J9/042 ,  B25J9/1065 ,  B25J9/107 ,  H01L21/67742 ,  Y10S901/15 ,  Y10T74/20305

Abstract: A link structure includes a first link, a second link having an end that is connected to an end of the first link, a third link having an end that is connected to the end of the first link, and provided on a portion of the second link, a first rotary shaft partially provided in the first link, a first actuator configured to rotate the first link about the first rotary shaft; a second rotary shaft partially provided in the second link, the second rotary shaft being different from the first rotary shaft, and a second actuator configured to rotate the second link about the second rotary shaft, the first and second actuators being provided in the first link.

公开(公告)号：US10665490B2

公开(公告)日：2020-05-26

申请号：US16240230

申请日：2019-01-04

Applicant: Samsung Electronics Co., Ltd.

Inventor： Ja-Woo Lee ,  Keon-Woo Kim ,  Sun-Ho Kim ,  Eung-Su Kim ,  Bo-Ra Yoon ,  Hyan-Jung Lee ,  Tae-Il Cho

IPC: H01L21/68 ,  H01J37/32 ,  H01L21/67 ,  H01L21/687 ,  H01L21/683

Abstract: A first edge ring is removed from a substrate support within a process module using a transfer robot. The transfer robot is then used to place a second edge ring on the substrate support. An image sensor (e.g., a disk-shaped wireless image sensor) is positioned over the second edge ring using the transfer robot. The image sensor generates image information, which is analyzed to determine alignment of the second edge ring.

公开(公告)号：USD727963S1

公开(公告)日：2015-04-28

申请号：US29455030

申请日：2013-05-16

Applicant: Samsung Electronics Co., Ltd.

Designer： Bo-Won Kim ,  Sun-Ho Kim

公开(公告)号：US10013023B2

公开(公告)日：2018-07-03

申请号：US15185858

申请日：2016-06-17

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sun-Ho Kim ,  Chul-Hyung Yang ,  Ji-Woo Lee

IPC: G06F1/16 ,  G06F1/18 ,  H04M1/02

CPC classification number: G06F1/1626 ,  G06F1/182 ,  G06F1/183 ,  H04M1/02

Abstract: An electronic device and a method for disassembling the electronic device are provided. The electronic device includes a housing including at least one of a first plate or a second plate, when the housing includes the first plate and the second plate, the second plate faces in an opposite direction to the first plate, a substrate disposed between the first and second plates in substantially parallel with the first and second plates, a first attachment layer disposed between the first plate and the substrate, and a second attachment layer disposed between the second plate and the substrate. When the first and second attachment layers are seen from above the first plate, the first and second attachment layers overlap with each other at least partially, and one of the first and second attachment layer includes at least one tear line extended at least partially across the one attachment layer.

公开(公告)号：USD736238S1

公开(公告)日：2015-08-11

申请号：US29456248

申请日：2013-05-29

Applicant: Samsung Electronics Co., Ltd.

Designer： Sun-Ho Kim

公开(公告)号：US11189467B2

公开(公告)日：2021-11-30

申请号：US16444590

申请日：2019-06-18

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jin-Uk Park ,  Sun-Ho Kim ,  Sung-Jin Kim ,  Jong-Geug Kim ,  Kyu-Chul Shim ,  Ji-Hoon Yeo ,  Shin-Sang Lee ,  Gyu-Chan Jeoung ,  Sung-Wook Jung ,  Jae-Chul Hwang

IPC: H01J37/32 ,  H01L21/687

Abstract: An apparatus for attaching a pad on or to an edge ring includes a chamber defining a space for attaching a pad on or to an edge ring, a pad support within the chamber and supporting the pad thereon, an edge ring support within the chamber and facing the pad support, the edge ring support securing the edge ring thereon, a driving system connected to at least one of the pad support and the edge ring support and configured to move the edge ring support relative to the pad support, and a vacuum exhaust system configured to create a vacuum atmosphere within the chamber.

公开(公告)号：US20200013657A1

公开(公告)日：2020-01-09

申请号：US16240230

申请日：2019-01-04

Applicant: Samsung Electronics Co., Ltd.

Inventor： Ja-Woo Lee ,  Keon-Woo Kim ,  Sun-Ho Kim ,  Eung-Su Kim ,  Bo-Ra Yoon ,  Hyan-Jung Lee ,  Tae-Il Cho

IPC: H01L21/68 ,  H01J37/32 ,  H01L21/67 ,  H01L21/687 ,  H01L21/683

Abstract: A first edge ring is removed from a substrate support within a process module using a transfer robot. The transfer robot is then used to place a second edge ring on the substrate support. An image sensor (e.g., a disk-shaped wireless image sensor) is positioned over the second edge ring using the transfer robot. The image sensor generates image information, which is analyzed to determine alignment of the second edge ring.