公开(公告)号：US11553068B2

公开(公告)日：2023-01-10

申请号：US16958878

申请日：2019-01-08

Applicant: Samsung Electronics Co., Ltd.

Inventor： Soogyu Lee ,  Joonwon Chang ,  Minsoo Kim ,  Kyujin Kwak ,  Jinwan An

IPC: H04M1/02 ,  H01R24/60

Abstract: An electronic device according to various embodiments of the present invention comprises: a housing that includes a first plate oriented in a first direction, a second plate oriented in a second direction opposite to the first direction, and a side member covering a space between the first plate and the second plate; a printed circuit board disposed in the space of the housing; a contact structure that is processed and formed toward at least one side of the printed circuit board from the side member of the housing and provides a contact point with an external electronic device; and a contact point structure that is disposed between the contact structure and the printed circuit board. The contact structure includes: at least one contact part of which at least a part is exposed to an external space and is made of the same material as the side member; and an insulating part, disposed around the at least one contact part, for separating the contact part and the side member from each other.

公开(公告)号：US20230179692A1

公开(公告)日：2023-06-08

申请号：US18076631

申请日：2022-12-07

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sanghyeon Kim ,  Ohhee Lee ,  Bongjo Choi ,  Junmin Ji ,  Dongjin Seo ,  Soogyu Lee

IPC: H04M1/02

CPC classification number: H04M1/026

Abstract: An electronic device may include: a housing including an opening; a circuit board disposed in the housing; a socket disposed on the circuit board; and a tray to be inserted into the socket. The tray may include: a body including an accommodation space; a connection member disposed adjacent to the body and including a first fixing region and a second fixing region spaced apart from the first fixing region; and a cover including a support portion for shielding the opening and an operation portion formed adjacent to the support portion, and coupled to the connection member to be pivotable between a first position and a second position. The operation portion may include a fixing portion in at least part thereof, the fixing portion may be disposed in the first fixing region at the first position and in the second fixing region at the second position, and when an external force is applied to the support portion at the first position, at least part of the operation portion may be movable from the first fixing region to the second fixing region in contact with at least part of the connection member.

公开(公告)号：US11758032B2

公开(公告)日：2023-09-12

申请号：US17654423

申请日：2022-03-11

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Soogyu Lee ,  Minsoo Kim ,  Ryounghun Kim ,  Sanghyeon Kim ,  Yunjae Jun ,  Jinwan An

IPC: H04M1/02 ,  H04M1/72484

CPC classification number: H04M1/0218 ,  H04M1/0268 ,  H04M1/72484

Abstract: An electronic device according to various embodiments of the disclosure may include a first housing structure, a second housing structure arranged adjacent to the first housing structure, a hinge structure arranged between the first housing structure and the second housing structure and providing a rotational movement between the first housing structure and the second housing structure, a flexible display extending from the first housing structure to the second housing structure, across the hinge structure, and at least one haptic actuator arranged in the hinge structure or adjacent to the hinge structure. The at least one haptic actuator may be arranged in parallel with the folding axis direction of the hinge structure so as to output vibrations corresponding to the folding axis.

公开(公告)号：US12015727B2

公开(公告)日：2024-06-18

申请号：US17533601

申请日：2021-11-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Gunwoo Lee ,  Soogyu Lee ,  Sungsoo Jun ,  Ryounghun Kim ,  Sanghyeon Kim

IPC: H04M1/02

CPC classification number: H04M1/0249 ,  H04M1/0262 ,  H04M1/0277

Abstract: An electronic device is provided. The electronic device includes a housing including a first plate, a second plate, and a side member, a support member disposed in the space between the first plate and the second plate, a first conductive area included in the side member, a protruding area included in the first conductive area protruding from the first conductive area toward an interior of the housing, and electrically connected to the first conductive area, a first circuit board disposed on one surface of the support member, a reinforcement member protruding from the one surface of the support member toward the second direction, a second circuit board extending further than the first circuit board toward the protruding area, and disposed on the reinforcement member, and a connection member electrically connecting the protruding area and the second circuit board, and disposed on the second circuit board.