公开(公告)号：US11830737B2

公开(公告)日：2023-11-28

申请号：US17520634

申请日：2021-11-06

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hanhum Park ,  Insung Kim ,  Woojeong Shin ,  Jung-Hoon Lee ,  Sanghyeon Kim ,  Ji Young Choi

IPC: H01L21/033

CPC classification number: H01L21/0338 ,  H01L21/0335 ,  H01L21/0337

Abstract: Disclosed are semiconductor device fabricating method and semiconductor device fabricated by the same. The method includes forming on a lower mask layer first upper mask patterns and sacrificial spacers that cover sidewalls of the first upper mask patterns, forming first holes in the lower mask layer below the first upper mask patterns, forming second holes in the lower mask layer not covered by the first upper mask patterns and the sacrificial spacers, forming second upper mask patterns filling a space between the sacrificial spacers on the lower mask layer and also forming sacrificial patterns filling the first and second holes, removing the sacrificial spacers, using the first and second upper mask patterns to etch the lower mask layer, and removing the sacrificial patterns.

公开(公告)号：US11758032B2

公开(公告)日：2023-09-12

申请号：US17654423

申请日：2022-03-11

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Soogyu Lee ,  Minsoo Kim ,  Ryounghun Kim ,  Sanghyeon Kim ,  Yunjae Jun ,  Jinwan An

IPC: H04M1/02 ,  H04M1/72484

CPC classification number: H04M1/0218 ,  H04M1/0268 ,  H04M1/72484

Abstract: An electronic device according to various embodiments of the disclosure may include a first housing structure, a second housing structure arranged adjacent to the first housing structure, a hinge structure arranged between the first housing structure and the second housing structure and providing a rotational movement between the first housing structure and the second housing structure, a flexible display extending from the first housing structure to the second housing structure, across the hinge structure, and at least one haptic actuator arranged in the hinge structure or adjacent to the hinge structure. The at least one haptic actuator may be arranged in parallel with the folding axis direction of the hinge structure so as to output vibrations corresponding to the folding axis.

公开(公告)号：US20230179692A1

公开(公告)日：2023-06-08

申请号：US18076631

申请日：2022-12-07

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sanghyeon Kim ,  Ohhee Lee ,  Bongjo Choi ,  Junmin Ji ,  Dongjin Seo ,  Soogyu Lee

IPC: H04M1/02

CPC classification number: H04M1/026

Abstract: An electronic device may include: a housing including an opening; a circuit board disposed in the housing; a socket disposed on the circuit board; and a tray to be inserted into the socket. The tray may include: a body including an accommodation space; a connection member disposed adjacent to the body and including a first fixing region and a second fixing region spaced apart from the first fixing region; and a cover including a support portion for shielding the opening and an operation portion formed adjacent to the support portion, and coupled to the connection member to be pivotable between a first position and a second position. The operation portion may include a fixing portion in at least part thereof, the fixing portion may be disposed in the first fixing region at the first position and in the second fixing region at the second position, and when an external force is applied to the support portion at the first position, at least part of the operation portion may be movable from the first fixing region to the second fixing region in contact with at least part of the connection member.

公开(公告)号：US20250046619A1

公开(公告)日：2025-02-06

申请号：US18791926

申请日：2024-08-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Guifu Yang ,  Sunghwan Jang ,  Sanghyeon Kim ,  Jinbum Kim ,  Hanhum Park ,  Sunguk Jang

IPC: H01L21/3115 ,  H01L21/033 ,  H01L21/311 ,  H01L21/3213

Abstract: A method of manufacturing a semiconductor apparatus includes forming a target layer, a bottom mask layer including a first mask, and a photoresist pattern, on a substrate; contracting the photoresist pattern; forming a mandrill bar on the first mask layer using the photoresist pattern that had been contracted; forming a conformal spacer layer on the first mask and the mandrill bar; etching the spacer layer such that at least a portion of the first mask is free of the spacer layer; forming a sacrificial layer on the at least the portion of the first mask; forming a hard-mask bar by etching the spacer layer and the first mask; and patterning the target layer using the hard-mask bar.

公开(公告)号：US12015727B2

公开(公告)日：2024-06-18

申请号：US17533601

申请日：2021-11-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Gunwoo Lee ,  Soogyu Lee ,  Sungsoo Jun ,  Ryounghun Kim ,  Sanghyeon Kim

IPC: H04M1/02

CPC classification number: H04M1/0249 ,  H04M1/0262 ,  H04M1/0277

Abstract: An electronic device is provided. The electronic device includes a housing including a first plate, a second plate, and a side member, a support member disposed in the space between the first plate and the second plate, a first conductive area included in the side member, a protruding area included in the first conductive area protruding from the first conductive area toward an interior of the housing, and electrically connected to the first conductive area, a first circuit board disposed on one surface of the support member, a reinforcement member protruding from the one surface of the support member toward the second direction, a second circuit board extending further than the first circuit board toward the protruding area, and disposed on the reinforcement member, and a connection member electrically connecting the protruding area and the second circuit board, and disposed on the second circuit board.