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公开(公告)号:US10352964B2
公开(公告)日:2019-07-16
申请号:US15415034
申请日:2017-01-25
Applicant: Samsung Electronics Co., Ltd.
Inventor: Kyeong-mi Lee , Jeong-ju Park , Shi-yong Yi , Eun-sung Kim , Seung-chul Kwon , Sang-ouk Kim , Young-joo Choi
IPC: G01Q70/14 , G01Q60/28 , H01L21/67 , G01Q60/42 , H01L27/108
Abstract: A method of forming a micropattern, a substrate surface inspection apparatus, a cantilever set for an atomic force microscope, and a method of analyzing a surface of a semiconductor substrate, and a probe tip the method including forming pinning patterns on a semiconductor substrate; forming a neutral pattern layer in spaces between the pinning patterns; and inspecting a surface of a guide layer that includes the pinning patterns and the neutral pattern layer by using an atomic force microscope (AFM).
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公开(公告)号:US09653294B2
公开(公告)日:2017-05-16
申请号:US14957777
申请日:2015-12-03
Applicant: Samsung Electronics Co., Ltd.
Inventor: Eun-sung Kim , Dae-yong Kang , Seung-chul Kwon , Shi-yong Yi
IPC: H01L21/302 , H01L21/033 , H01L21/308 , H01L21/311 , H01L21/3213 , H01L27/108
CPC classification number: H01L21/0337 , H01L21/0332 , H01L21/3086 , H01L21/31144 , H01L21/32139 , H01L27/10855
Abstract: The present inventive concept provides a method of forming a fine pattern including forming a plurality of pillar-shaped guides that are regularly arranged on a feature layer.
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