METAL OXIDE SEMICONDUCTOR FIELD-EFFECT TRANSISTOR (MOSFET) DEVICES AND MANUFACTURING METHODS THEREOF

    公开(公告)号:US20210336026A1

    公开(公告)日:2021-10-28

    申请号:US17206832

    申请日:2021-03-19

    Abstract: Provided are metal oxide field-effect transistor (MOSFET) devices having a metal gate structure, in which a work function of the metal gate structure is uniform along a length direction of a channel, and manufacturing methods thereof. The MOSFET devices include a semiconductor substrate, an active area on the semiconductor substrate and extending in a first direction, and a gate structure on the semiconductor substrate. The gate structure extends across the active area in a second direction that traverses the first direction and comprises a high-k layer, a first metal layer, a work function control (WFC) layer, and a second metal layer, which are sequentially stacked on the active area. A lower surface of the WFC layer may be longer than a first interface between a lower surface of the first metal layer and an upper surface of the high-k layer in the first direction.

    METAL OXIDE SEMICONDUCTOR FIELD-EFFECT TRANSISTOR (MOSFET) DEVICES AND MANUFACTURING METHODS THEREOF

    公开(公告)号:US20230068212A1

    公开(公告)日:2023-03-02

    申请号:US18053777

    申请日:2022-11-09

    Abstract: Provided are metal oxide field-effect transistor (MOSFET) devices having a metal gate structure, in which a work function of the metal gate structure is uniform along a length direction of a channel, and manufacturing methods thereof. The MOSFET devices include a semiconductor substrate, an active area on the semiconductor substrate and extending in a first direction, and a gate structure on the semiconductor substrate. The gate structure extends across the active area in a second direction that traverses the first direction and comprises a high-k layer, a first metal layer, a work function control (WFC) layer, and a second metal layer, which are sequentially stacked on the active area. A lower surface of the WFC layer may be longer than a first interface between a lower surface of the first metal layer and an upper surface of the high-k layer in the first direction.

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