公开(公告)号：US20250162081A1

公开(公告)日：2025-05-22

申请号：US18906657

申请日：2024-10-04

Applicant: Samsung Electronics Co., Ltd.

Inventor： Dongju PARK ,  Jaeheung LEE ,  Namtae HEO

IPC: B23K26/38 ,  B23K26/0622

Abstract: A laser processing apparatus includes a stage configured to support a substrate that is a processing object, a laser irradiation portion configured to focus a laser beam inside the substrate to form a laser damage layer inside the substrate along a cutting line, and a thermoreflectance measurement portion configured to irradiate a detection light onto an adjacent region near a region where the laser beam is focused and detect light reflected from the adjacent region to determine a location of splash defect in the adjacent region generated by the laser beam.

公开(公告)号：US20250121454A1

公开(公告)日：2025-04-17

申请号：US18732741

申请日：2024-06-04

Applicant: Samsung Electronics Co., Ltd.

Inventor： Narae HAN ,  Jaeheung LEE ,  Namtae HEO

IPC: B23K26/06 ,  B23K26/067 ,  B23K26/082 ,  B23K26/38 ,  B23K26/70 ,  B23K101/36

Abstract: A laser processing apparatus includes a stage configured to support a substrate to be processed, a laser light source configured to generate a laser beam, a mode converter configured to convert the laser beam into a cylindrical vector beam, a polarizing filter configured to polarize the cylindrical vector beam to form a double-o shaped beam in which two beams are arranged adjacent to each other in a first horizontal direction, a condensing lens configured to condense the double-o shaped beam into first and second laser beams at first and second spots apart in the first horizontal direction on the substrate, and a driving portion configured to move the first and second laser beams relatively with respect to the substrate in a second horizontal direction different from the first horizontal direction.