公开(公告)号：US20220282372A1

公开(公告)日：2022-09-08

申请号：US17543807

申请日：2021-12-07

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jaeheung LEE ,  Junseong PARK ,  Kanghun LEE ,  Seongwan KIM ,  Hyouncheol KIM

IPC: C23C16/455 ,  C23C16/52 ,  H01L21/67

Abstract: A vacuum valve includes a valve flange having a first port, a second port, and a valve seat in a space between the first port and the second port, a valve body in the valve flange, the valve body having a contact surface facing the valve seat, and the valve body being moveable to have the contact surface contact the valve seat and to be separated from the valve seat, a disk on the contact surface of the valve body, the disk having an inclined surface inclined toward the second port, and an actuator connected to the valve flange, the actuator being configured to apply a driving force to the valve body to move the contact surface of the valve body into or out of contact with the valve seat.

公开(公告)号：US20250162081A1

公开(公告)日：2025-05-22

申请号：US18906657

申请日：2024-10-04

Applicant: Samsung Electronics Co., Ltd.

Inventor： Dongju PARK ,  Jaeheung LEE ,  Namtae HEO

IPC: B23K26/38 ,  B23K26/0622

Abstract: A laser processing apparatus includes a stage configured to support a substrate that is a processing object, a laser irradiation portion configured to focus a laser beam inside the substrate to form a laser damage layer inside the substrate along a cutting line, and a thermoreflectance measurement portion configured to irradiate a detection light onto an adjacent region near a region where the laser beam is focused and detect light reflected from the adjacent region to determine a location of splash defect in the adjacent region generated by the laser beam.

公开(公告)号：US20250121454A1

公开(公告)日：2025-04-17

申请号：US18732741

申请日：2024-06-04

Applicant: Samsung Electronics Co., Ltd.

Inventor： Narae HAN ,  Jaeheung LEE ,  Namtae HEO

IPC: B23K26/06 ,  B23K26/067 ,  B23K26/082 ,  B23K26/38 ,  B23K26/70 ,  B23K101/36

Abstract: A laser processing apparatus includes a stage configured to support a substrate to be processed, a laser light source configured to generate a laser beam, a mode converter configured to convert the laser beam into a cylindrical vector beam, a polarizing filter configured to polarize the cylindrical vector beam to form a double-o shaped beam in which two beams are arranged adjacent to each other in a first horizontal direction, a condensing lens configured to condense the double-o shaped beam into first and second laser beams at first and second spots apart in the first horizontal direction on the substrate, and a driving portion configured to move the first and second laser beams relatively with respect to the substrate in a second horizontal direction different from the first horizontal direction.