公开(公告)号：US20250162081A1

公开(公告)日：2025-05-22

申请号：US18906657

申请日：2024-10-04

Applicant: Samsung Electronics Co., Ltd.

Inventor： Dongju PARK ,  Jaeheung LEE ,  Namtae HEO

IPC: B23K26/38 ,  B23K26/0622

Abstract: A laser processing apparatus includes a stage configured to support a substrate that is a processing object, a laser irradiation portion configured to focus a laser beam inside the substrate to form a laser damage layer inside the substrate along a cutting line, and a thermoreflectance measurement portion configured to irradiate a detection light onto an adjacent region near a region where the laser beam is focused and detect light reflected from the adjacent region to determine a location of splash defect in the adjacent region generated by the laser beam.