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    SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
    4.
    发明申请
    SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME 有权

    公开(公告)号：US20230084281A1

    公开(公告)日：2023-03-16

    申请号：US17750586

    申请日：2022-05-23

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Na-Young Kim ,  Seongho Kim ,  Hoonmin Kim

    IPC: H01L27/11531 ,  H01L27/11529

    Abstract: A semiconductor device includes a substrate including cell and peripheral regions. Landing pads and contact plugs are on the cell and peripheral regions, respectively. A first filler pattern fills regions between the landing pads and between the contact plugs. Outer voids are in the first filler pattern and include first and second outer voids on the cell and peripheral regions, respectively. A second filler pattern covers the first filler pattern and the contact plugs and fills at least a portion of the second outer void. An inner void is in the second outer void and enclosed by the second filler pattern. The first and second filler patterns include the same material. On the cell region, at least a portion of the second filler pattern is located below top surfaces of the landing pads, and a bottom surface of the second filler pattern is partially exposed by the first outer void.

    Electronic device and method for controlling pressure input
    6.
    发明授权
    Electronic device and method for controlling pressure input 有权

    公开(公告)号：US11029797B2

    公开(公告)日：2021-06-08

    申请号：US16614138

    申请日：2018-06-11

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Na-Young Kim ,  Dae-Hwan Kim ,  Seung-Wook Nam ,  Kwang-Tai Kim ,  Hyung-Sup Byeon ,  Cheol-Ho Cheong

    IPC: G06F3/044 ,  G06F3/041 ,  G06F3/0484 ,  G06F3/0488 ,  G06F3/0482

    Abstract: An electronic device according to various embodiments of the present invention comprises: a housing including a first plate and a second plate spaced apart from the first plate; a touch screen display disposed inside the housing and exposed through a part of the first plate; a pressure sensing circuit disposed between the first plate and the second plate, and configured to detect pressure caused by an external pressure applied to at least a part of the touch screen display; a wireless communication circuit disposed inside the housing; at least one processor disposed inside the housing and electrically connected to the touch screen display, the pressure sensing circuit, and the wireless communication circuit; and a memory disposed inside the housing and electrically connected to the processor, wherein the memory is configured to store an application program including a user interface and instructions, wherein the instructions are configured to cause the processor to, when executed, display at least one object on the user interface on the touch screen display, detect a pressure level for a user input in the at least one object or in the periphery thereof by using the pressure sensing circuit, and select one of a plurality of operations, related to the at least one object, on the basis of at least one part of the detected pressure level. Other embodiments are also possible.

    Semiconductor device and method of fabricating the same
    10.
    发明授权
    Semiconductor device and method of fabricating the same 有权

    公开(公告)号：US12279427B2

    公开(公告)日：2025-04-15

    申请号：US17750586

    申请日：2022-05-23

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Na-Young Kim ,  Seongho Kim ,  Hoonmin Kim

    IPC: H10B41/42 ,  H10B41/41

    Abstract: A semiconductor device includes a substrate including cell and peripheral regions. Landing pads and contact plugs are on the cell and peripheral regions, respectively. A first filler pattern fills regions between the landing pads and between the contact plugs. Outer voids are in the first filler pattern and include first and second outer voids on the cell and peripheral regions, respectively. A second filler pattern covers the first filler pattern and the contact plugs and fills at least a portion of the second outer void. An inner void is in the second outer void and enclosed by the second filler pattern. The first and second filler patterns include the same material. On the cell region, at least a portion of the second filler pattern is located below top surfaces of the landing pads, and a bottom surface of the second filler pattern is partially exposed by the first outer void.

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