公开(公告)号：US20250031363A1

公开(公告)日：2025-01-23

申请号：US18413813

申请日：2024-01-16

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Minju KANG ,  Jongmin KIM ,  Sangjae PARK ,  Sohyun PARK ,  Kiseok LEE

IPC: H10B12/00 ,  H10N50/80 ,  H10N70/00

Abstract: A semiconductor device includes a first active pattern including a first edge portion and a second edge portion spaced apart from the first edge portion in a first direction, a first word line between the first edge portion and the second edge portion and extending in a second direction intersecting the first direction, a bit line on the first edge portion and extending in a third direction intersecting the first direction and the second direction, and a storage node contact on the second edge portion, where the first edge portion includes a first top surface and a second top surface, and the second top surface of the first edge portion is closer to the second edge portion than the first top surface of the first edge portion.

公开(公告)号：US20240268102A1

公开(公告)日：2024-08-08

申请号：US18471583

申请日：2023-09-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kiseok LEE ,  Seung-Bo KO ,  Jongmin KIM ,  Hui-Jung KIM ,  SangJae PARK ,  Taejin PARK ,  Chan-Sic YOON ,  Myeong-Dong LEE ,  Hongjun LEE ,  Minju KANG ,  Keunnam KIM

IPC: H10B12/00

CPC classification number: H10B12/485 ,  H10B12/482 ,  H10B12/488

Abstract: A semiconductor device includes first and second active patterns extending in a first direction and arranged in a second direction intersecting the first direction, each of the first and second active patterns including first and second edge portions spaced apart from each other in the first direction, a first storage node pad and a first storage node contact sequentially provided on the first edge portion of the first active pattern, and a second storage node pad and a second storage node contact sequentially provided on the second edge portion of the second active pattern. Each of the first and second storage node contacts includes a metal material.