公开(公告)号：US20230115351A1

公开(公告)日：2023-04-13

申请号：US17804732

申请日：2022-05-31

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Takashi Sasa ,  Kyoung Whan Oh ,  Sang Ho Lee ,  Seok Heo ,  Ho Kyun Kim ,  Ju Hyung Lee

IPC: G03F7/20

Abstract: A photoresist supplying system includes a pump that includes a first tube phragm that stores a photoresist and a filter that filters the photoresist, a second tube phragm that stores the photoresist and is disposed outside the pump, where the second tube phragm transfers the photoresist to the first tube phragm, a storage unit that stores the photoresist, where the storage unit provides the photoresist to the second tube phragm, and a tube phragm drive unit that is connected to the first tube phragm. The tube phragm drive unit adjusts an interior volume of the first tube phragm and applies a pressure to a flexible outer wall of the first tube phragm to transfer the photoresist from the first tube phragm to a nozzle installed in the chamber. At least a part of the photoresist stored in the first tube phragm is transferred to the second tube phragm.

公开(公告)号：US10442034B2

公开(公告)日：2019-10-15

申请号：US15281578

申请日：2016-09-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyoung Whan Oh ,  Yeon Woo Choi ,  In Hwan Kim ,  Won Ki Park ,  Ho Youl Lee ,  Yong Won Choi

IPC: B23K26/08 ,  B23K26/402 ,  B23K26/03 ,  B23K26/38 ,  H01L21/67 ,  H01L21/78 ,  B23K103/00 ,  B23K101/40

Abstract: A wafer cutting apparatus includes a stage to support a wafer, a cutter, and a sensor. The cutter irradiates the wafer with a beam in a first direction to cut the wafer. The sensor is spaced apart from the cutter in a second direction different from the first direction, and measures a spaced distance between the wafer and the cutter. The sensor measures the spaced distance between the wafer and the cutter along a second cutting line parallel to a first cutting line while the cutter cuts the wafer along the first cutting line on the wafer.

公开(公告)号：US11733616B2

公开(公告)日：2023-08-22

申请号：US17804732

申请日：2022-05-31

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Takashi Sasa ,  Kyoung Whan Oh ,  Sang Ho Lee ,  Seok Heo ,  Ho Kyun Kim ,  Ju Hyung Lee

IPC: G03F7/20 ,  G03F7/00

CPC classification number: G03F7/70908

Abstract: A photoresist supplying system includes a pump that includes a first tube phragm that stores a photoresist and a filter that filters the photoresist, a second tube phragm that stores the photoresist and is disposed outside the pump, where the second tube phragm transfers the photoresist to the first tube phragm, a storage unit that stores the photoresist, where the storage unit provides the photoresist to the second tube phragm, and a tube phragm drive unit that is connected to the first tube phragm. The tube phragm drive unit adjusts an interior volume of the first tube phragm and applies a pressure to a flexible outer wall of the first tube phragm to transfer the photoresist from the first tube phragm to a nozzle installed in the chamber. At least a part of the photoresist stored in the first tube phragm is transferred to the second tube phragm.

公开(公告)号：US10546765B2

公开(公告)日：2020-01-28

申请号：US15474276

申请日：2017-03-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kyoung Whan Oh ,  Yeon Woo Choi ,  Won Yup Ko ,  Min Seok Moon ,  Won Ki Park ,  Seung Hwan Lee ,  Yong Won Choi

IPC: H01L21/67 ,  H01L21/68 ,  B23K26/00 ,  B23K26/38 ,  B23K26/53 ,  H01L21/687 ,  B23K101/40 ,  B23K103/00

Abstract: A wafer perforating device includes a chuck stage configured to receive a wafer, a housing spaced apart in a vertical direction on the chuck stage, wherein at least one of the housing and the chuck stage moves in a first horizontal direction, and the housing and the chuck stage intersect each other on the first direction, a displacement sensor fixed within the housing and configured to measure a displacement with a surface of the wafer at a perforating point spaced apart periodically in the first direction of the wafer and a laser module fixed within the housing and configured to irradiate a laser into a perforating depth determined according to the displacement at the perforating point. The displacement sensor determines whether an upper particle and a lower particle are present at the perforating point by considering a step height of the displacement, and ignores the displacement of the perforating point with the presence of an upper particle.