公开(公告)号：US20170209960A1

公开(公告)日：2017-07-27

申请号：US15281578

申请日：2016-09-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyoung Whan OH ,  Yeon Woo CHOI ,  In Hwan KIM ,  Won Ki PARK ,  Ho Youl LEE ,  Yong Won CHOI

IPC: B23K26/08 ,  B23K26/402 ,  B23K26/03 ,  B23K26/38 ,  H01L21/67 ,  H01L21/78

CPC classification number: B23K26/0876 ,  B23K26/03 ,  B23K26/032 ,  B23K26/38 ,  B23K26/402 ,  B23K2101/40 ,  B23K2103/56 ,  H01L21/67092 ,  H01L21/67259 ,  H01L21/78

Abstract: A wafer cutting apparatus includes a stage to support a wafer, a cutter, and a sensor. The cutter irradiates the wafer with a beam in a first direction to cut the wafer. The sensor is spaced apart from the cutter in a second direction different from the first direction, and measures a spaced distance between the wafer and the cutter. The sensor measures the spaced distance between the wafer and the cutter along a second cutting line parallel to a first cutting line while the cutter cuts the wafer along the first cutting line on the wafer.

公开(公告)号：US20180076060A1

公开(公告)日：2018-03-15

申请号：US15474276

申请日：2017-03-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kyoung Whan OH ,  Yeon Woo CHOI ,  Won Yup KO ,  Min Seok MOON ,  Won Ki PARK ,  Seung Hwan LEE ,  Yong Won CHOI

IPC: H01L21/67 ,  H01L21/687 ,  B23K26/00 ,  B23K26/38

CPC classification number: H01L21/67115 ,  B23K26/032 ,  B23K26/048 ,  B23K26/0853 ,  B23K26/0861 ,  B23K26/0869 ,  B23K26/0884 ,  B23K26/38 ,  B23K26/53 ,  B23K26/702 ,  B23K2101/40 ,  B23K2103/56 ,  H01L21/67051 ,  H01L21/67092 ,  H01L21/67248 ,  H01L21/67253 ,  H01L21/67259 ,  H01L21/67288 ,  H01L21/68757

Abstract: A wafer perforating device includes a chuck stage configured to receive a wafer, a housing spaced apart in a vertical direction on the chuck stage, wherein at least one of the housing and the chuck stage moves in a first horizontal direction, and the housing and the chuck stage intersect each other on the first direction, a displacement sensor fixed within the housing and configured to measure a displacement with a surface of the wafer at a perforating point spaced apart periodically in the first direction of the wafer and a laser module fixed within the housing and configured to irradiate a laser into a perforating depth determined according to the displacement at the perforating point. The displacement sensor determines whether an upper particle and a lower particle are present at the perforating point by considering a step height of the displacement, and ignores the displacement of the perforating point with the presence of an upper particle.

公开(公告)号：US20240226941A1

公开(公告)日：2024-07-11

申请号：US18502055

申请日：2023-11-05

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jun Hee LEE ,  Kyoung Whan OH ,  Ho Kyun KIM

IPC: B05B12/00 ,  B05B1/08

CPC classification number: B05B12/006 ,  B05B1/08

Abstract: An apparatus for supplying a treating material includes a nozzle discharging the treating material onto a substrate. A flow pipe channels the treating material to the nozzle. A cut-off valve connected to the flow pipe controls the discharge the treating material. A first controller controls a first opening and closing of the cut-off valve. A second controller controls a second opening and closing of the cut-off valve. The second opening and closing of the cut-off valve is performed by the second controller after a delay time has elapsed after the first opening and closing is completed.

公开(公告)号：US20230170232A1

公开(公告)日：2023-06-01

申请号：US18101709

申请日：2023-01-26

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyoung Whan OH ,  Kyung-Won KANG ,  Hyeon Jun KANG ,  Ju Bong LEE ,  Sung Hun JANG ,  Seok HEO ,  Hyun Woong HWANG

IPC: H01L21/67 ,  B05B12/12 ,  H01L21/68

CPC classification number: H01L21/67259 ,  B05B12/124 ,  H01L21/681 ,  H01L21/6715 ,  B25J11/0075

Abstract: A manufacturing apparatus for a semiconductor device, the manufacturing apparatus including a spin chuck configured to fix and rotate a wafer; a nozzle configured to spray a chemical toward the wafer; a lateral displacement sensor configured to measure a displacement variation to a lateral surface of the wafer while the spin chuck is rotating; and a controller configured to control a position of the nozzle by using the displacement variation while the spin chuck is rotating.