公开(公告)号：US20180076060A1

公开(公告)日：2018-03-15

申请号：US15474276

申请日：2017-03-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kyoung Whan OH ,  Yeon Woo CHOI ,  Won Yup KO ,  Min Seok MOON ,  Won Ki PARK ,  Seung Hwan LEE ,  Yong Won CHOI

IPC: H01L21/67 ,  H01L21/687 ,  B23K26/00 ,  B23K26/38

CPC classification number: H01L21/67115 ,  B23K26/032 ,  B23K26/048 ,  B23K26/0853 ,  B23K26/0861 ,  B23K26/0869 ,  B23K26/0884 ,  B23K26/38 ,  B23K26/53 ,  B23K26/702 ,  B23K2101/40 ,  B23K2103/56 ,  H01L21/67051 ,  H01L21/67092 ,  H01L21/67248 ,  H01L21/67253 ,  H01L21/67259 ,  H01L21/67288 ,  H01L21/68757

Abstract: A wafer perforating device includes a chuck stage configured to receive a wafer, a housing spaced apart in a vertical direction on the chuck stage, wherein at least one of the housing and the chuck stage moves in a first horizontal direction, and the housing and the chuck stage intersect each other on the first direction, a displacement sensor fixed within the housing and configured to measure a displacement with a surface of the wafer at a perforating point spaced apart periodically in the first direction of the wafer and a laser module fixed within the housing and configured to irradiate a laser into a perforating depth determined according to the displacement at the perforating point. The displacement sensor determines whether an upper particle and a lower particle are present at the perforating point by considering a step height of the displacement, and ignores the displacement of the perforating point with the presence of an upper particle.