Substrate processing apparatus
    1.
    发明授权

    公开(公告)号:US10224185B2

    公开(公告)日:2019-03-05

    申请号:US14689559

    申请日:2015-04-17

    Abstract: A substrate processing apparatus including a process chamber configured to receive a plurality of substrates oriented in a horizontal manner and vertically arranged with respect to the process chamber, a process gas supply unit configured to supply at least one process gas to the process chamber through a process gas supply nozzle, the process gas supply nozzle along an inner wall of the process chamber in a direction in which the substrates are sacked, an exhaust unit configured to exhaust the process gas from the process chamber, and a blocking gas supply unit configured to supply a blocking gas through a blocking gas injector provided in a circumferential direction of the process chamber such that a flow of the process gas in the process chamber is controlled may be provided.

    Gas sensing device, electronic device including the gas sensing device, and gas sensing system

    公开(公告)号:US11181508B2

    公开(公告)日:2021-11-23

    申请号:US16416704

    申请日:2019-05-20

    Abstract: A gas sensing system includes a driving circuit chip, and a gas sensor, a temperature sensor, and a humidity sensor, which are located on the driving circuit chip. The gas sensing system compensates a gas sensing result based on at least one of a temperature sensing result and a humidity sensing result and generates a gas sensing signal. The gas sensor includes a first resonator and a first sensing film being configured to sense a first gas and located on the first resonator to be exposed to the outside. The temperature sensor includes a second resonator and an encapsulation layer located above the second resonator not to expose the second resonator to the outside, and the humidity sensor includes a third resonator.

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