公开(公告)号：US20180358242A1

公开(公告)日：2018-12-13

申请号：US15827144

申请日：2017-11-30

申请人： Samsung Electronics Co., Ltd.

发明人： Young-hoo Kim ,  Sang-jine PARK ,  Yong-jhin CHO ,  Yeon-jin GIL ,  Ji-hoon JEONG ,  Byung-kwon CHO ,  Yong-sun KO ,  Kun-tack LEE

IPC分类号： H01L21/67 ,  H01L21/687

CPC分类号： H01L21/67034 ,  H01L21/02101 ,  H01L21/67126 ,  H01L21/68735

摘要： A substrate processing apparatus includes a vessel providing a processing space for processing a substrate, a substrate support supporting the substrate loaded in the processing space, and a barrier between a side wall of the vessel and the substrate support and surrounding an edge of the substrate supported by the substrate support.

公开(公告)号：US20210217635A1

公开(公告)日：2021-07-15

申请号：US17215928

申请日：2021-03-29

申请人： Samsung Electronics Co., Ltd.

发明人： Young-hoo Kim ,  Sang-jine PARK ,  Yong-jhin CHO ,  Yeon-jin GIL ,  Ji-hoon JEONG ,  Byung-kwon CHO ,  Yong-sun KO ,  Kun-tack LEE

IPC分类号： H01L21/67 ,  H01L21/687

摘要： A substrate processing apparatus includes a vessel providing a processing space for processing a substrate, a substrate support supporting the substrate loaded in the processing space, and a barrier between a side wall of the vessel and the substrate support and surrounding an edge of the substrate supported by the substrate support.