- 专利标题： Substrate Processing Apparatus and Apparatus for Manufacturing Integrated Circuit Device
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申请号： US15827144申请日： 2017-11-30
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公开(公告)号： US20180358242A1公开(公告)日： 2018-12-13
- 发明人: Young-hoo Kim , Sang-jine PARK , Yong-jhin CHO , Yeon-jin GIL , Ji-hoon JEONG , Byung-kwon CHO , Yong-sun KO , Kun-tack LEE
- 申请人： Samsung Electronics Co., Ltd.
- 优先权： KR10-2017-0071729 20170608
- 主分类号： H01L21/67
- IPC分类号： H01L21/67 ; H01L21/687
摘要：
A substrate processing apparatus includes a vessel providing a processing space for processing a substrate, a substrate support supporting the substrate loaded in the processing space, and a barrier between a side wall of the vessel and the substrate support and surrounding an edge of the substrate supported by the substrate support.
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