公开(公告)号：US20230180381A1

公开(公告)日：2023-06-08

申请号：US18071903

申请日：2022-11-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kanggyune Lee ,  Hyunggil Baek ,  Youngja Kim ,  Seungjin Lee

IPC: H05K1/02 ,  H01L23/544 ,  H01L23/498 ,  H01L25/10

CPC classification number: H05K1/0269 ,  H01L23/544 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49838 ,  H01L25/105 ,  H01L2223/54426 ,  H05K1/113

Abstract: A printed circuit board includes a substrate base; a plurality of ball lands arranged on a surface of the substrate base; a cutting position identification mark disposed on a corner of the surface of the substrate base; and at least one alignment mark disposed on the surface of the substrate base to be spaced apart from the ball lands and exposed to the outside, wherein top surfaces of the ball lands and a top surface of the at least one alignment mark are at substantially the same vertical level and the ball lands and the at least one alignment mark include the same material.

公开(公告)号：US20250124565A1

公开(公告)日：2025-04-17

申请号：US18667687

申请日：2024-05-17

Applicant: Samsung Electronics Co., Ltd.

Inventor： Minwoo Jeon ,  Kanggyune Lee

IPC: G06T7/00

Abstract: Provided is a mark inspection method of a semiconductor package. The method includes receiving a measured image of a semiconductor package comprising a mark including at least one of a figure and a character string, receiving a standard defect image corresponding to the measured image, the standard defect image includes the mark having a defect comprising at least one of misprinting, cutting, blur, noise, displacement, double printing, reverse printing, bay, and thermochromic phenomena, generating a fake image through a deep learning model using a generative adversarial network (GAN) with the measured image and the standard defect image, and comparing the fake image with the measured image.