公开(公告)号：US20250001548A1

公开(公告)日：2025-01-02

申请号：US18538337

申请日：2023-12-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jwahyeon KIM ,  Kyungyeol KIM ,  Taesung KIM ,  Hyuntae KIM ,  Byunghyuck AHN

IPC: B24B45/00 ,  B24B7/22

Abstract: A grinder may include a spindle, a grinding wheel and a mount disk. The spindle may be configured to generate a rotary force. The grinding wheel may be configured to receive the rotary force from the spindle and grind an object. The mount disk may be between the spindle and the grinding wheel and may be configured automatically engage or disengage the grinding wheel based on a rotation direction of the mount disk. Thus, an exchange or replacement of the grinding wheel may be performed in a short time by rotating the spindle so that the grinding wheel is disengaged from the mount disk.

公开(公告)号：US20230017080A1

公开(公告)日：2023-01-19

申请号：US17709941

申请日：2022-03-31

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jwahyeon KIM ,  Sungjoon JOO ,  Bongsu CHO ,  Kyungho HA

IPC: B24B55/06 ,  B24B37/34

Abstract: A substrate processing apparatus includes a first polishing chamber, a second polishing chamber, a dry polishing chamber and a loading chamber on a turntable. The dry polishing chamber includes a polishing device on the turntable, and a chamber cover including a cover plate, an interception filter at an intake port at the cover plate, and a particle barrier connected to the cover plate. The particle barrier faces the interception filter, and is between the polishing device and the interception filter.