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公开(公告)号：US20230017080A1
公开(公告)日：2023-01-19
申请号：US17709941
申请日：2022-03-31
Applicant: Samsung Electronics Co., Ltd.
Inventor： Jwahyeon KIM , Sungjoon JOO , Bongsu CHO , Kyungho HA
Abstract: A substrate processing apparatus includes a first polishing chamber, a second polishing chamber, a dry polishing chamber and a loading chamber on a turntable. The dry polishing chamber includes a polishing device on the turntable, and a chamber cover including a cover plate, an interception filter at an intake port at the cover plate, and a particle barrier connected to the cover plate. The particle barrier faces the interception filter, and is between the polishing device and the interception filter.
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