公开(公告)号：US20150303201A1

公开(公告)日：2015-10-22

申请号：US14591165

申请日：2015-01-07

Applicant: Samsung Electronics Co., Ltd.

Inventor： Dongjin LEE ,  Sungho JANG ,  Jiyoung KIM ,  Kang-Uk KIM ,  Chan Min LEE ,  Juyeon JANG

IPC: H01L27/108 ,  H01L21/768 ,  H01L21/285 ,  H01L21/311

CPC classification number: H01L27/10885 ,  H01L21/32134 ,  H01L21/32135 ,  H01L21/32139 ,  H01L27/10888 ,  H01L27/10894 ,  H01L27/10897

Abstract: Semiconductor devices, and methods for forming the same, include forming a first wiring film and an etching buffer film in a cell array region and a peripheral circuit region of a substrate, and forming a contact hole by selectively etching the etching buffer film and the first wiring film so as to expose an active region of the cell array region and at least a part of a field isolation region adjacent thereto. A bit line contact is formed in the contact hole to be in contact with the active region, and a second wiring film is formed over the substrate. By patterning the second wiring film, the bit line contact, the etching buffer film, and the first wiring film, a bit line is formed in the cell array region and a peripheral gate is formed in the peripheral circuit region.

Abstract translation: 半导体器件及其形成方法包括在基板的单元阵列区域和外围电路区域中形成第一布线膜和蚀刻缓冲膜，并且通过选择性蚀刻蚀刻缓冲膜和第一布线膜形成接触孔 布线膜以暴露电池阵列区域的有源区域和与其相邻的场隔离区域的至少一部分。 在接触孔中形成与有源区接触的位线接触，在基板上形成第二布线膜。 通过图案化第二布线膜，位线接触，蚀刻缓冲膜和第一布线膜，在单元阵列区域中形成位线，并且在外围电路区域中形成周边栅极。